Datasheet

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Trace Width
TPA2013D1
SLOS520 – AUGUST 2007
Recommended trace width at the solder balls is 75 μ m to 100 μ m to prevent solder wicking onto wider PCB
traces.
For high current pins (SW, PGND, VOUT+, VOUT – , V
CC
IN, and V
CC
OUT) of the TPA2013D1, use 100 μ m trace
widths at the solder balls and at least 500 μ m PCB traces to ensure proper performance and output power for
the device.
For low current pins (IN – , IN+, SDd, SDb, GAIN, V
CC
FB, V
DD
) of the TPA2013D1, use 75 μ m to 100 μ m trace
widths at the solder balls. Run IN- and IN+ traces side-by-side to maximize common-mode noise cancellation.
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Product Folder Link(s): TPA2013D1