Datasheet

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DEVICE INFORMATION
V
CC
FB
SW SW V
CC
OUT
V
CC
IN
SDb
IN+
IN–
PGND PGND
SDd
V
DD
PGND
RGP (QFN)Package
(TopView)
TPA2013D1RGP
2
5
7 10
11
14
1720
GAIN
AGND
VOUT–
VOUT–
VOUT+
VOUT+
VOUT+
V
CC
FB
SW
V
CC
OUTV
CC
IN
SDb
IN+ IN–
PGND
AGNDSDd
PGNDVOUT–
V
DD
GAINVOUT+
PGND
D1 D2
D3
D4
C1 C2
C3
C4
B1
B3
B4
B2
A1 A2
A3
A4
YZH (WCSP)Package
(TopView)
TPA2013D1YZH
1819 16
13
12
15
3
4
1
8 96
TPA2013D1
SLOS520 – AUGUST 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
BOOST CONVERTER TERMINAL FUNCTIONS
TERMINAL
I/O DESCRIPTION
NAME QFN WCSP
IN+ 8 D2 I Positive audio input
IN – 7 D3 I Negative audio input
VOUT+ 13, 14, 15 B1 O Positive audio output
VOUT – 11, 12 C1 O Negative audio output
SDb 6 D4 I Shutdown terminal for the Boost Converter
SDd 5 C3 I Shutdown terminal for the Class D Amplifier
SW 18, 19 A3 – Boost and rectifying switch input
V
CC
OUT 17 A2 – Boost converter output - connect to V
CC
IN
GAIN 3 B2 I Gain selection pin
V
CC
IN 16 A1 – Class-D audio power amplifier voltage supply - connect to V
CC
OUT
V
CC
FB 2 B3 I Voltage feedback
V
DD
1 B4 – Supply voltage
AGND 4 C4 – Analog ground - connect all GND pins together
PGND 9, 10, 20 D1, C2, A4 – Power ground - connect all GND pins together
Thermal Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB.
Die Pad N/A P
Pad It is required for mechanical stability and will enhance thermal performance.
2 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TPA2013D1