Datasheet

DESCRIPTION (CONTINUED)
ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATING TABLE
RECOMMENDED OPERATING CONDITIONS
TPA2012D2
SLOS438D DECEMBER 2004 REVISED JUNE 2008 ..................................................................................................................................................
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
The TPA2012D2 is capable of driving 1.4 W/Ch at 5 V or 720 mW/Ch at 3.6 V into 8 . The TPA2012D2 is also
capable of driving 4 . The TPA2012D2 is thermally limited in WCSP and may not achieve 2.1 W/Ch for 4 .
The maximum output power in the WCSP is determined by the ability of the circuit board to remove heat. The
output power versus load resistance graph below shows thermally limited region of the WCSP in relation to the
QFN package. The TPA2012D2 provides thermal and short circuit protection.
AVAILABLE OPTIONS
T
A
PACKAGE PART NUMBER SYMBOL
2 mm x 2 mm, 16-ball WCSP (YZH) TPA2012D2YZH AKR
40 ° C to 85 ° C
4 mm x 4 mm, 20-pin QFN (RTJ) TPA2012D2RTJ AKS
over operating free-air temperature (unless otherwise noted)
(1)
VALUE UNIT
In active mode 0.3 to 6.0 V
V
SS
Supply voltage, AVDD, PVDD
In shutdown mode 0.3 to 7.0 V
V
I
Input voltage 0.3 to V
DD
+ 0.3 V
Continuous total power dissipation See Dissipation Rating Table
T
A
Operating free-air temperature range 40 to 85 ° C
T
J
Operating junction temperature range 40 to 150 ° C
T
stg
Storage temperature range 65 to 150 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
T
A
= 25 ° C DERATING T
A
= 75 ° C T
A
= 85 ° C
PACKAGE
POWER RATING
(1)
FACTOR POWER RATING POWER RATING
RTJ 5.2 W 41.6 mW/ ° C 3.12 W 2.7 W
YZH 1.2 W 9.12 mW/ ° C 690 mW 600 mW
(1) This data was taken using 2 oz trace and copper pad that is soldered directly to a JEDEC standard 4-layer 3 in × 3 in PCB.
MIN MAX UNIT
V
SS
Supply voltage AVDD, PVDD 2.5 5.5 V
V
IH
High-level input voltage SDL, SDR, G0, G1 1.3 V
V
IL
Low-level input voltage SDL, SDR, G0, G1 0.35 V
T
A
Operating free-air temperature ÷ 40 85 ° C
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Product Folder Link(s): TPA2012D2