Datasheet

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375 mm
(+0, -25 mm)
275 mm
(+0, -25 mm)
Circular Solder Mask Opening
Paste Mask (Stencil)
= Copper Pad Size
75 mm
100 mm
100 mm
100 mm
100 mm
100 mm
75 mm
75 mm
EFFICIENCY AND THERMAL INFORMATION
q
JA
+
1
Derating Factor
+
1
0.0078
+ 128.2°CńW
(17)
T
A
Max + T
J
Max * q
JA
P
Dmax
+ 150 * 128.2 (0.4) + 98.72°C
(18)
ELIMINATING THE OUTPUT FILTER WITH THE TPA2010D1
TPA2010D1
SLOS417C – OCTOBER 2003 – REVISED SEPTEMBER 2007
Figure 34. Close Up of TPA2010D1 Land Pattern From TPA2010D1 EVM
The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factor
for the YEF and YEZ packages are shown in the dissipation rating table. Converting this to θ
JA
:
Given θ
JA
of 128.2 ° C/W, the maximum allowable junction temperature of 150 ° C, and the maximum internal
dissipation of 0.4 W (2.25 W, 4- Ω load, 5-V supply, from Figure 3 ), the maximum ambient temperature can be
calculated with the following equation.
Equation 18 shows that the calculated maximum ambient temperature is 98.72 ° C at maximum power dissipation
with a 5-V supply and 4- Ω a load, see Figure 3 . The TPA2010D1 is designed with thermal protection that turns
the device off when the junction temperature surpasses 165 ° C ~ 190 ° C to prevent damage to the IC. Also, using
speakers more resistive than 4- Ω dramatically increases the thermal performance by reducing the output current
and increasing the efficiency of the amplifier.
This section focuses on why the user can eliminate the output filter with the TPA2010D1.
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Product Folder Link(s): TPA2010D1