Datasheet

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_
+
IN-
IN+
PWM H-
Bridge
V
O+
V
O-
Internal
Oscillator
C
S
To Battery
V
DD
GND
Bias
Circuitry
R
I2
R
P
Filter-Free Class D
SHUTDOWN
R
I1
Single-Ended
Input 2
C
I2
C
P
Single-Ended
Input 1
C
I1
BOARD LAYOUT
Copper
Trace Width
Solder Mask
Thickness
Solder
Pad Width
Solder Mask
Opening
Copper Trace
Thickness
TPA2010D1
SLOS417C – OCTOBER 2003 – REVISED SEPTEMBER 2007
Figure 32. Application Schematic With TPA2010D1 Summing Two Single-Ended Inputs
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 33 and Table 2 show the appropriate diameters for a
WCSP layout. The TPA2010D1 evaluation module (EVM) layout is shown in the next section as a layout
example.
Figure 33. Land Pattern Dimensions
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Product Folder Link(s): TPA2010D1