Datasheet

BOARD LAYOUT
Component Location
Trace Width
MicroStar Junior™ BGA Layout
0,28
mm
0,38
mm
0,25
mm
SD
NC
IN+
IN−
GND GND
GND
GND GND
GND GND
VDD
VDD
Vo+
Vo−
Solder Mask
Paste Mask
Copper Trace
TPA2005D1
SLOS369F – JULY 2002 – REVISED JULY 2008 ............................................................................................................................................................... www.ti.com
Place all the external components close to the TPA2005D1. The input resistors need to be close to the
TPA2005D1 input pins so noise does not couple on the high impedance nodes between the input resistors and
the input amplifier of the TPA2005D1. Placing the decoupling capacitor, C
S
, close to the TPA2005D1 is important
for the efficiency of the class-D amplifier. Any resistance or inductance in the trace between the device and the
capacitor can cause a loss in efficiency.
Make the high current traces going to pins VDD, GND, V
O+
and V
O-
of the TPA2005D1 have a minimum width of
0,7 mm. If these traces are too thin, the TPA2005D1's performance and output power will decrease. The input
traces do not need to be wide, but do need to run side-by-side to enable common-mode noise cancellation.
Use the following MicroStar Junior BGA ball diameters:
• 0,25 mm diameter solder mask
• 0,28 mm diameter solder paste mask/stencil
• 0,38 mm diameter copper trace
Figure 38 shows how to lay out a board for the TPA2005D1 MicroStar Junior BGA.
Figure 38. TPA2005D1 MicroStar Junior BGA Board Layout (Top View)
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Product Folder Link(s): TPA2005D1