Datasheet
SLOS327C − AUGUST 2000 − REVISED MAY 2001
12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
selection of components
Figure 20 and Figure 21 are schematic diagrams of typical notebook computer application circuits.
ROUT+ 12
R
MUX
RHPIN
RLINEIN
+
−
18
17
C
IRHP
0.47 µF
Right
Head−
phone
Input
Signal
C
IRLINE
0.47 µF
Right
Line
Input
Signal
C
RIN
0.47 µF
9 RIN
ROUT− 14
+
−
1 kΩ
C
OUTR
330 µF
100 kΩ
L
MUX
LHPIN
LLINEIN6
7
C
ILHP
0.47 µF
Left
Head−
phone
Input
Signal
C
ILLINE
0.47 µF
Left
Line
Input
Signal
C
LIN
0.47 µF
5 LIN
1 kΩ
C
OUTR
330 µF
V
DD
100 kΩ
Depop
Circuitry
Power
Management
PV
DD
19
V
DD
20
BYPASS 21
SHUT-
DOWN
22
GND
LOUT+ 2
+
−
LOUT− 24
+
−
C
BYP
0.47 µF
1,13
To
System
Control
C
SR
0.1 µF
V
DD
C
SR
0.1 µF
V
DD
See Note A
PC-
Beep
PC-BEEP
3
C
PCB
0.47 µF
PC-BEEP
Input
Signal
MUX
Control
SE/BTL
11
PV
DD
8
10 µF
V
DD
10 µF
A0
4
A1
10
I
2
C
Control
SDA
SCL
I
2
CV
DD
15
23
16
I
2
C Address
To I
2
C Bus
I
2
C Bus Voltage
64-Step
Volume
Control
64-Step
Volume
Control
NOTE A: A 0.1-µF ceramic capacitor should be placed as close as possible to the IC. For filtering lower-frequency noise signals, a larger
electrolytic capacitor of 10 µF or greater should be placed near the audio power amplifier.
Figure 20. Typical TPA0172 Application Circuit Using Single-Ended Inputs and Input MUX