Datasheet

TMS320F28335, TMS320F28334, TMS320F28332

TMS320F28235, TMS320F28234, TMS320F28232

www.ti.com

SPRS439M –JUNE 2007–REVISED AUGUST 2012

6-53 Sequential Sampling Mode Timing ........................................................................................... 172

6-54 Simultaneous Sampling Mode Timing ....................................................................................... 173

6-55 McBSP Timing Requirements ................................................................................................ 175

6-56 McBSP Switching Characteristics ........................................................................................... 176

6-57 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0) ................................ 178

6-58 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)............................ 178

6-59 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0) ................................ 179

6-60 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)............................ 179

6-61 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1) ................................ 180

6-62 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)............................ 180

6-63 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1) ................................ 181

6-64 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1) ........................... 181

6-65 Flash Endurance for A and S Temperature Material ...................................................................... 182

6-66 Flash Endurance for Q Temperature Material .............................................................................. 182

6-67 Flash Parameters at 150-MHz SYSCLKOUT ............................................................................... 182

6-68 Flash/OTP Access Timing ..................................................................................................... 182

6-69 Flash Data Retention Duration................................................................................................ 182

6-70 Minimum Required Flash/OTP Wait-States at Different Frequencies ................................................... 183

9-1 Thermal Model 176-Pin PGF Results ........................................................................................ 187

9-2 Thermal Model 176-Pin PTP Results ........................................................................................ 187

9-3 Thermal Model 179-Ball ZHH Results ....................................................................................... 187

9-4 Thermal Model 176-Ball ZJZ Results ....................................................................................... 188