Datasheet

TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
www.ti.com SPRS439M –JUNE 2007–REVISED AUGUST 2012
9 Thermal and Mechanical Data
Table 9-1, Table 9-2, Table 9-3, and Table 9-4 show the thermal data. See Section 6.4.3 for more
information on thermal design considerations.
The mechanical package diagrams that follow the tables reflect the most current released mechanical data
available for the designated devices.
Table 9-1. Thermal Model 176-Pin PGF Results
AIR FLOW
PARAMETER 0 lfm 150 lfm 250 lfm 500 lfm
θ
JA
[°C/W] High k PCB 44 34.5 33 31
Ψ
JT
[°C/W] 0.12 0.48 0.57 0.74
Ψ
JB
28.1 26.3 25.9 25.2
θ
JC
8.2
θ
JB
28.1
Table 9-2. Thermal Model 176-Pin PTP Results
AIR FLOW
PARAMETER 0 lfm 150 lfm 250 lfm 500 lfm
θ
JA
[°C/W] High k PCB 17.4 11.7 10.1 8.8
Ψ
JT
[°C/W] 0.2 0.3 0.4 0.5
Ψ
JB
5.0 4.7 4.7 4.6
θ
JC
12.1
θ
JB
5.1
Table 9-3. Thermal Model 179-Ball ZHH Results
AIR FLOW
PARAMETER 0 lfm 150 lfm 250 lfm 500 lfm
θ
JA
[°C/W] High k PCB 32.8 24.1 22.9 20.9
Ψ
JT
[°C/W] 0.09 0.3 0.36 0.48
Ψ
JB
12.4 11.8 11.7 11.5
θ
JC
8.8
θ
JB
12.5
Copyright © 2007–2012, Texas Instruments Incorporated Thermal and Mechanical Data 187
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TMS320F28232