Datasheet

TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066
TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062
SPRS698D –NOVEMBER 2010–REVISED DECEMBER 2012 www.ti.com
7.1.1 Thermal Design Considerations
Based on the end application design and operational profile, the I
DD
and I
DDIO
currents could vary.
Systems that exceed the recommended maximum power dissipation in the end product may require
additional thermal enhancements. Ambient temperature (T
A
) varies with the end application and product
design. The critical factor that affects reliability and functionality is T
J
, the junction temperature, not the
ambient temperature. Hence, care should be taken to keep T
J
within the specified limits. T
case
should be
measured to estimate the operating junction temperature T
J
. T
case
is normally measured at the center of
the package top-side surface. The thermal application reports IC Package Thermal Metrics (literature
number SPRA953) and Reliability Data for TMS320LF24xx and TMS320F28xx Devices (literature number
SPRA963) help to understand the thermal metrics and definitions.
7.2 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated devices. This data is subject to change without notice and without revision of this document.
160 Mechanical Packaging and Orderable Information Copyright © 2010–2012, Texas Instruments Incorporated
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Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065
TMS320F28064 TMS320F28063 TMS320F28062