Datasheet

TMS320F28030, TMS320F28031, TMS320F28032
TMS320F28033, TMS320F28034, TMS320F28035
www.ti.com
SPRS584J APRIL 2009REVISED OCTOBER 2013
7 Thermal/Mechanical Data
Table 7-1, Table 7-2, and Table 7-3 show the thermal data. See Section 6.5 for more information on
thermal design considerations.
The mechanical package diagrams that follow the tables reflect the most current released mechanical data
available for the designated devices.
Table 7-1. Thermal Model 56-Pin RSH Results
AIR FLOW
PARAMETER 0 lfm 150 lfm 250 lfm 500 lfm
θ
JA
[°C/W] High k PCB 34.8 23.6 22.3 20.5
Ψ
JT
[°C/W] 0.24 0.36 0.43 0.56
Ψ
JB
9.2 8.8 8.9 8.8
θ
JC
14.7
θ
JB
9.2
Table 7-2. Thermal Model 64-Pin PAG Results
AIR FLOW
PARAMETER 0 lfm 150 lfm 250 lfm 500 lfm
θ
JA
[°C/W] High k PCB 56.5 44.7 42.9 40.3
Ψ
JT
[°C/W] 0.15 0.42 0.51 0.67
Ψ
JB
31.1 29.7 29.2 28.4
θ
JC
7.6
θ
JB
31.3
Table 7-3. Thermal Model 80-Pin PN Results
AIR FLOW
PARAMETER 0 lfm 150 lfm 250 lfm 500 lfm
θ
JA
[°C/W] High k PCB 49.9 38.3 36.7 34.4
Ψ
JT
[°C/W] 0.8 1.18 1.34 1.62
Ψ
JB
21.6 20.7 20.5 20.1
θ
JC
14.2
θ
JB
21.9
Copyright © 2009–2013, Texas Instruments Incorporated Thermal/Mechanical Data 147
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