Digital Media System-on-Chip (DMSoC) Product Preview

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PRODUCT PREVIEW
7 Mechanical Data
7.1 Thermal Data for ZCE
7.1.1 Packaging Information
TMS320DM355
Digital Media System-on-Chip (DMSoC)
SPRS463A – SEPTEMBER 2007 – REVISED SEPTEMBER 2007
The following table(s) show the thermal resistance characteristics for the PBGA – ZCE mechanical
package. Note that micro-vias are not required. Contact your TI representative for routing
recommendations.
The following table shows the thermal resistance characteristics for the PBGA – ZCE mechanical
package.
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZCE]
NO. μ C/W AIR FLOW (m/s)
(1)
1 R Θ
JC
Junction-to-case TBD TBD
2 R Θ
JB
Junction-to-board TBD TBD
3 R Θ
JA
Junction-to-free air TBD TBD
4 Psi
JT
Junction-to-package top TBD TBD
5 Psi
JB
Junction-to-board TBD TBD
(1) m/s = meters per second
The following packaging information and reflect the most current data available for the designated device.
This data is subject to change without notice and without revision of this document. Note that micro-vias
are not required for this package.
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