Datasheet

Temperature (°C) Vs Leakage current (mA)
0
100
200
300
400
500
600
-20 0 20 40 60 80 100 120 140
Temperature (°C)
Leakage current (mA)
TMS320C28346, TMS320C28345, TMS320C28344
TMS320C28343, TMS320C28342, TMS320C28341
www.ti.com SPRS516D –MARCH 2009–REVISED AUGUST 2012
6.4.1 Reducing Current Consumption
Methods of reducing current consumption include the following:
• Turn off the clock to any peripheral module that is not used in a given application since each peripheral
unit has an individual clock-enable bit. Table 6-3 indicates the typical reduction in current consumption
achieved by turning off the clocks.
• Use any one of the three low-power modes to reduce current even further.
• Turn off XCLKOUT, reducing I
DDIO
current consumption by 15 mA (typical).
• Disable the pullups on pins that assume an output function and on XINTF pins for significant savings
in I
DDIO
.
NOTE
The TMS320C2834x devices are manufactured in a high-performance process node.
Compared to the previous generation of the C28x devices, this process has more leakage
current. Leakage current is significantly impacted by the operating temperature, and the
increase in current with temperature is non-linear. The total power for a given operating
condition includes switching/active power plus leakage power. Low-power HALT mode power
is due to the leakage current alone.
Figure 6-1 shows the typical leakage current across temperature.
Figure 6-1. Temperature Versus Leakage Current (Typical)
Copyright © 2009–2012, Texas Instruments Incorporated Electrical Specifications 111
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TMS320C28341