Datasheet
TMP709
SBOS583A –DECEMBER 2011– REVISED FEBRUARY 2012
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
PACKAGE
PRODUCT PACKAGE-LEAD DESIGNATOR PACKAGE MARKING ORDERING NUMBER
TMP709AIDBVR
TMP709 SOT23-5 DBV SBJ
TMP709AIDBVT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
TMP709 UNIT
Supply voltage range (VCC) –0.3 to 6 V
Input voltage range (SET and HYST) –0.3 to (V
CC
+ 0.3) V
Output voltage range (OT) –0.3 to 6 V
Input current 20 mA
Output current 20 mA
Operating temperature, T
A
–40 to +125 °C
Storage temperature, T
stg
–65 to +150 °C
Junction temperature, T
J
+150 °C
Human body model (HBM) 4000 V
ESD ratings Charged device model (CDM) 1000 V
Machine model (MM) 200 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
THERMAL INFORMATION
TMP709
THERMAL METRIC
(1)
DBV (SOT23) UNITS
5 PINS
θ
JA
Junction-to-ambient thermal resistance 217.9
θ
JCtop
Junction-to-case (top) thermal resistance 86.3
θ
JB
Junction-to-board thermal resistance 44.6
°C/W
ψ
JT
Junction-to-top characterization parameter 4.4
ψ
JB
Junction-to-board characterization parameter 43.8
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Link(s): TMP709