Datasheet

TMP422
DX1
(4)
DX2
(4)
5
2
1
R
S
(2)
R
S
(2)
C
DIFF
(3)
C
DIFF
(3)
R
S
(2)
R
S
(2)
GND
Diode-connectedconfiguration :
(1)
SeriesResistance
Transistor-connectedconfiguration :
(1)
DX3
(4)
DX4
(4)
4
3
R
S
(2)
R
S
(2)
C
DIFF
(3)
0.1 Fm
10kW
(typ)
10kW
(typ)
V+
8
7
6
SCL
SDA
+5V
SMBus
Controller
DXP1
DXN1
DXP2
DXN2
+5V
TMP423
DXP1
DXP2
DXP3
DXP
DXN
DXN
SCL
GND
SDA
V+
2
3
4
7
1
6
8
R
S
(2)
R
S
(2)
R
S
(2)
R
S
(2)
R
S
(2)
R
S
(2)
C
DIFF
(3)
C
DIFF
(3)
C
DIFF
(3)
Transistor-connectedconfiguration :
(1)
C
DIFF
(3)
R
S
(2)
R
S
(2)
Diode-connectedconfiguration :
(1)
5
0.1 Fm
10kW
(typ)
10kW
(typ)
SMBus
Controller
SeriesResistance
TMP421
TMP422
TMP423
SBOS398C –JULY 2007–REVISED MAY 2012 www.ti.com
(1) Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance
cancellation.
(2) R
S
(optional) should be < 1.5kΩ in most applications. Selection of R
S
depends on application; see the Filtering section.
(3) C
DIFF
(optional) should be < 1000pF in most applications. Selection of C
DIFF
depends on application; see the Filtering section and
Figure 6, Remote Temperature Error vs Differential Capacitance.
(4) TMP422 SMBus slave address is 1001 100 when connected as shown.
Figure 12. TMP422 Basic Connections
(1) Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance
cancellation.
(2) R
S
(optional) should be < 1.5kΩ in most applications. Selection of R
S
depends on application; see the Filtering section.
(3) C
DIFF
(optional) should be < 1000pF in most applications. Selection of C
DIFF
depends on application; see the Filtering section and
Figure 6, Remote Temperature Error vs Differential Capacitance.
Figure 13. TMP423 Basic Connections
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