Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TMP411ADGKR VSSOP DGK 8 2500 370.0 355.0 55.0
TMP411ADGKR VSSOP DGK 8 2500 366.0 364.0 50.0
TMP411ADGKT VSSOP DGK 8 250 366.0 364.0 50.0
TMP411ADR SOIC D 8 2500 367.0 367.0 35.0
TMP411BDGKR VSSOP DGK 8 2500 366.0 364.0 50.0
TMP411BDGKR VSSOP DGK 8 2500 370.0 355.0 55.0
TMP411BDGKT VSSOP DGK 8 250 366.0 364.0 50.0
TMP411BDR SOIC D 8 2500 367.0 367.0 35.0
TMP411CDGKR VSSOP DGK 8 2500 366.0 364.0 50.0
TMP411CDGKT VSSOP DGK 8 250 366.0 364.0 50.0
TMP411CDR SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2013
Pack Materials-Page 2