Datasheet

TMP303A
TMP303B
SBOS486B –JULY 2009–REVISED JANUARY 2011 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION
(1)
PRODUCT PACKAGE PACKAGE DESIGNATOR PACKAGE MARKING
TMP303A OCO
SOT563 DRL
TMP303B QWM
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
TMP303A, TMP303B UNIT
Supply Voltage, V
S
– GND +3.6 V
Input Pins, Voltage SOH, HYST
SET1
, HYST
SET0
–0.5 to V
S
+0.5 V
Output Pin, Voltage OUT –0.5 to V
S
+0.5 V
Output Pin, Current OUT 8 mA
Operating Temperature Range –55 to +130 °C
Storage Temperature Range –60 to +150 °C
Junction Temperature (T
J
max) +150 °C
Human Body Model (HBM) 2000 V
ESD Rating Charged Device Model (CDM) 1000 V
Machine Model (MM) 200 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
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Product Folder Link(s): TMP303A TMP303B