Datasheet
APPLICATION INFORMATION
TMP112
0.01mF
V+
GND
2
5
3
ALERT
(Output)
4
ADD0
1
SCL
6
SDA
To
Two-Wire
Controller
NOTE:SCL,SDA,andALERT
pinsrequirepull-upresistors.
Diode
Temp.
Sensor
DS
A/D
Converter
OSC
Control
Logic
Serial
Interface
Config.
andTemp.
Register
TMP112
Temperature
SCL
1
3
6
4
ALERT
SDA
GND
2 5
V+
ADD0
ALERT
Core
SCL
GND
V+
A0
V+
SDA
TMP112
TMP112
SBOS473B – MARCH 2009 – REVISED JUNE 2009 .........................................................................................................................................................
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The TMP112 is a digital temperature sensor that is
Pull-up resistors are required on SCL, SDA, and
optimal for thermal-management and
ALERT. A 0.01 µ F bypass capacitor is recommended,
thermal-protection applications. A block diagram of
as shown in Figure 10 .
the TMP112 is shown in Figure 8 . The TMP112 is
two-wire- and SMBus interface-compatible, and is
specified over an operating temperature range of
– 40 ° C to +125 ° C. Figure 9 illustrates the ESD
protection circuitry contained in the TMP112.
Figure 10. Typical Connections
The temperature sensor in the TMP112 is the chip
itself. Thermal paths run through the package leads
as well as the plastic package. The lower thermal
resistance of metal causes the leads to provide the
primary thermal path.
Figure 8. Internal Block Diagram
To maintain accuracy in applications that require air
or surface temperature measurement, care should be
taken to isolate the package and leads from ambient
air temperature. A thermally-conductive adhesive is
helpful in achieving accurate surface temperature
measurement.
Figure 9. Equivalent Internal ESD Circuitry
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