Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- TYPICAL APPLICATION
- ABSOLUTE MAXIMUM RATINGS
- THERMAL INFORMATION
- ELECTRICAL CHARACTERISTICS
- PIN CONFIGURATION
- TYPICAL CHARACTERISTICS
- APPLICATION INFORMATION
- GENERAL DESCRIPTION
- COMMUNICATION PROTOCOL
- COMMAND REGISTER
- GLOBAL INITIALIZATION AND ADDRESS ASSIGNMENT SEQUENCE
- GLOBAL READ AND WRITE
- GLOBAL CLEAR INTERRUPT
- GLOBAL SOFTWARE RESET
- INDIVIDUAL READ AND WRITE
- TEMPERATURE REGISTER
- CONFIGURATION REGISTER
- TEMPERATURE LIMIT REGISTERS
- TIMEOUT FUNCTION
- NOISE
- SMAART WIRE INTERFACE TIMING SPECIFICATIONS
- Revision History
TMP104
SBOS564A –NOVEMBER 2011– REVISED NOVEMBER 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
PACKAGE
PRODUCT PACKAGE-LEAD DESIGNATOR PACKAGE MARKING ORDERING NUMBER
TMP104YFFR
TMP104 DSBGA-4 YFF T4
TMP104YFFT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
TMP104 UNIT
Supply voltage 3.6 V
Input voltage –0.3 to (V+) + 0.3 V
Operating temperature –55 to +150 °C
Storage temperature –60 to +150 °C
Junction temperature +150 °C
Human body model (HBM) 2000 V
ESD rating Charged device model (CDM) 1000 V
Machine model (MM) 200 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
THERMAL INFORMATION
TMP104
THERMAL METRIC
(1)
YFF UNITS
4 PINS
θ
JA
Junction-to-ambient thermal resistance 188.5
θ
JCtop
Junction-to-case (top) thermal resistance 2.1
θ
JB
Junction-to-board thermal resistance 35.1
°C/W
ψ
JT
Junction-to-top characterization parameter 10.6
ψ
JB
Junction-to-board characterization parameter 35.1
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Link(s): TMP104