Datasheet

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Host

Device

(1)

Device

(2)

Device

(N 1)-

Device

(N)

RX_1 RX_2 RX_N

RX_(N 1)-

TX_1 TX_2

TX_(N 1)-

TX_(N)

Daisy-Chain

Configuration

Up to 16 TMP104 Devices in Daisy-Chain

TMP104

www.ti.com

SBOS564A –NOVEMBER 2011– REVISED NOVEMBER 2011

Low-Power, Digital Temperature Sensor

with SMAART Wire Interface

Check for Samples: TMP104

FEATURES

DESCRIPTION

The TMP104 is a digital output temperature sensor in

• Multiple Device Access (MDA):

a four-ball wafer chip-scale package (WCSP). The

– Global Read/Write Operations

TMP104 is capable of reading temperatures to a

• SMAART Wire Interface

resolution of 1°C.

• Resolution: 8 Bits

The TMP104 features a SMAART wire interface that

• Accuracy: ±0.5°C Typ (–10°C to +100°C)

supports daisy-chain configurations. In addition, the

interface supports multiple device access (MDA)

• Low Quiescent Current:

commands that allow the master to communicate with

– 3 μA Active I

at 0.25 Hz

multiple devices on the bus simultaneously,

– 1 μA Shutdown

eliminating the need to send individual commands to

each TMP104 on the bus.

• Supply Range: 1.4 V to 3.6 V

• Digital Output

Up to 16 TMP104s can be tied together in parallel

and easily read by the host. The TMP104 is

• Package: 0.8-mm (±5%) × 1-mm (±5%) 4-Ball

especially ideal for space-constrained,

WCSP (DSBGA)

power-sensitive applications with multiple

temperature measurement zones that must be

APPLICATIONS

monitored.

• Handsets

The TMP104 is specified for operation over a

• Notebooks

temperature range of –40°C to +125°C.

TYPICAL APPLICATION

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (22 pages)

PAGE 1
TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com Low-Power, Digital Temperature Sensor with SMAART Wire Interface Check for Samples: TMP104 FEATURES DESCRIPTION • The TMP104 is a digital output temperature sensor in a four-ball wafer chip-scale package (WCSP). The TMP104 is capable of reading temperatures to a resolution of 1°C. 1 2 • • • • • • • Multiple Device Access (MDA): – Global Read/Write Operations SMAART Wire Interface Resolution: 8 Bits Accuracy: ±0.
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TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
PAGE 3
TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS At TA = +25°C and V+ = +1.4 V to +3.6 V, unless otherwise noted. TMP104 PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEMPERATURE INPUT +125 °C –10°C to +100°C, V+ = 1.8 V –40 ±0.5 ±2 °C –40°C to +125°C, V+ = 1.8 V ±1 ±3 ±0.2 ±0.5 Range Accuracy (temperature error) vs supply Resolution °C °C/V °C 1.0 DIGITAL INPUT/OUTPUT VIH VIL IIN 0.7 × (V+) V+ V –0.5 0.
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TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com PIN CONFIGURATION YFF PACKAGE WCSP-4 (DSBGA-4) (TOP VIEW) B2 B1 TX RX A2 GND A1 V+ PIN DESCRIPTIONS PIN NO.
PAGE 5
TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C and V+ = 1.8 V, unless otherwise noted. QUIESCENT CURRENT vs TEMPERATURE (0.25 Conversions per Second) SHUTDOWN CURRENT vs TEMPERATURE 9 12 V+ = 1.4 V V+ = 1.8 V V+ = 3.6 V 10 7 6 ISD (mA) 8 IQ (mA) V+ = 1.8 V V+ = 3.6 V 8 6 5 4 3 4 2 2 1 0 0 -60 -40 -20 0 40 20 60 80 100 120 140 160 -60 -40 -20 20 40 60 80 Temperature (°C) Figure 1. Figure 2.
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TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com APPLICATION INFORMATION GENERAL DESCRIPTION The TMP104 is a digital output temperature sensor in a wafer chip-scale package (WCSP) that is optimal for thermal management and thermal profiling. The TMP104 includes a SMAART wire interface that is capable of communicating in a daisy-chain with up to 16 devices on a single bus.
PAGE 7
TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com The TMP104 has two dedicated pins for communication: TX and RX. Usually, these two pins are connected internally and the signal on the RX propagates to the TX; that is, the TMP104 works in a transparent mode. The TMP104 breaks this buffer configuration only when it must send data on the bus or during address assignment and alert procedures. The TMP104 supports unique address assignment and alert interrupt procedures.
PAGE 8
TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com GLOBAL INITIALIZATION AND ADDRESS ASSIGNMENT SEQUENCE At device power-up, every TMP104 in the daisy-chain is connected in transparent mode, as shown in Figure 7. The host must send the initialization command (P7-P0 = 10001100) in order for the bus to program its internal address depending on the number of devices on the bus.
PAGE 9
TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com GLOBAL READ AND WRITE The host can initiate a global read or write command to all TMP104s in the daisy-chain by sending the read/write command, consisting of P7-P3 = 11110. P2-P1 indicate the data register pointer, as shown in Table 3, and P0 indicates read/write control. P0 = 0 indicates a global write command.
PAGE 10
TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com INDIVIDUAL READ AND WRITE The host can initiate an individual read/write command to a particular TMP104 in the daisy-chain by sending the read/write command.
PAGE 11
TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com Negative numbers are represented in binary twos complement format. Following power-up or reset, the Temperature Register reads 0°C until the first conversion is complete. Table 5.
PAGE 12
TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com CONFIGURATION REGISTER The Configuration Register is an 8-bit read/write register used to store bits that control the operational modes of the temperature sensor. Read/write operations are performed LSB first. The format and power-up/reset value of the Configuration Register is shown in Table 6. Table 6.
PAGE 13
TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com Conversion Rate (CR1, CR0) The conversion rate bits (CR1 and CR0), located in the Configuration Register, configure the TMP104 for conversion rates of 8 Hz, 4 Hz, 1 Hz, or 0.25 Hz (default). The TMP104 has a typical conversion time of 26 ms. To achieve different conversion rates, the TMP104 performs a single conversion and then powers down and waits for the appropriate delay set by CR1 and CR0. Table 7 shows the settings for CR1 and CR0.
PAGE 14
TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.
PAGE 15
TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com TEMPERATURE LIMIT REGISTERS The THIGH and TLOW registers are used to store the temperature limit thresholds for the TMP104 watchdog function. At the end of each temperature measurement, the TMP104 compares the temperature results to each of these limits. If the temperature result is greater than the THIGH limit, then the FH bit in the Configuration Register is set to '1'.
PAGE 16
TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com SMAART WIRE INTERFACE TIMING SPECIFICATIONS Figure 15 illustrates the key timing and jitter considerations for the SMAART wire interface. Table 10 contains the timing specifications for ensured, reliable operation. During a transaction, the baud rate must remain within ±1% of its initialization byte value; however, the baud rate can change from transaction to transaction.
PAGE 17
TMP104 SBOS564A – NOVEMBER 2011 – REVISED NOVEMBER 2011 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (November 2011) to Revision A Page • Changed one-wire UART-style interface to SMAART wire interface throughout document ................................................ 1 • Changed description of protocol in Communication Protocol section ................................................................
PAGE 18
PACKAGE OPTION ADDENDUM www.ti.
PAGE 19
PACKAGE MATERIALS INFORMATION www.ti.com 28-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device TMP104YFFR Package Package Pins Type Drawing SPQ DSBGA 3000 YFF 4 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 180.0 8.4 Pack Materials-Page 1 0.86 B0 (mm) K0 (mm) P1 (mm) 1.06 0.69 4.0 W Pin1 (mm) Quadrant 8.
PAGE 20
PACKAGE MATERIALS INFORMATION www.ti.com 28-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP104YFFR DSBGA YFF 4 3000 182.0 182.0 17.
PAGE 21
D: Max = 0.99 mm, Min = 0.93 mm E: Max = 0.79 mm, Min = 0.
PAGE 22
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