TMS570LS12x Hercules Development Kit (HDK) User's Guide Literature Number: SPNU568A September 2012 – Revised September 2013
Contents A ....................................................................................................................................... 4 Introduction ........................................................................................................................ 5 1.1 Scope of Document ......................................................................................................... 5 1.2 TMS570LS12 HERCULES Development Kit (HDK) Features ........................................
www.ti.com List of Figures 1-1. TMS570LS12 HDK Board Block Diagram ............................................................................... 6 2-1. TMS570LS12 HDK Board, Interfaces Top Side ........................................................................ Connectors on TMS570LS12 HDK ....................................................................................... J2, J3 CAN Bus Interface (Screw Terminal) ...........................................................................
Preface SPNU568A – September 2012 – Revised September 2013 Read This First About This Manual This document describes the board level operations of the TMS570LS12 Hercules™ Development Kit (HDK). The HDK is based on the Texas Instruments TMS570LS1227 Microcontroller.
Chapter 1 SPNU568A – September 2012 – Revised September 2013 Introduction This development kit provides a product-ready hardware and software platform for evaluating the functionality of the Texas Instruments TMS570LS12 microcontroller family. Schematics, list of materials, and PCB layout are available to ease hardware development and reduce time to market. 1.
HDK Board Block Diagram 1.3 www.ti.com HDK Board Block Diagram Figure 1-1 illustrates the HDK block diagram. PWR USB EMU JTAG Pinmux DIP CAN PHY SDRAM EXP Conn3 ETM EXP Conn2 SPI/ADC TMS570LS1227 180 MHz CAN/ FRAY/LIN/ GIO/HET EMIF/ ETM/ SPI2 PIN MUX EXP Conn1 PIN MUX 3.3V/5V A/D Ext JTAG ENET PHY MII/ RMII CPLD RST SPI2 FTDI 2332 3.3V I/O ENET RJ45 XDS100V2 1.2V Core POR SD Slot CAN PHY GIO Button CAN1 CAN2 Light Sensor Temp Sensor Figure 1-1.
HDK Specifications www.ti.com 1.5 HDK Specifications • • • 1.6 Board supply voltage: 5 V–12 V Vdc Board supply current: 130 mA typ (fully active, CPU at 180 MHz) Dimensions: 4.90” x 4.30” x 0.85” (LxWxH) Basic Operation The HDK is designed to work with TI’s Code Composer Studio and other third party ARM IDEs. The IDE communicates with the board through the embedded emulator or an external JTAG emulator. To start, follow the instructions in the Quick Start Guide to install Hercules-specific software.
Chapter 2 SPNU568A – September 2012 – Revised September 2013 Physical Description This section describes the physical layout of the TMS570LS12 HDK board and its interfaces. 2.1 Board Layout The TMS570LS12 HDK board is a 4.9 x 4.3 inch (125 x 109 mm) eight layer printed circuit board that is powered by an external +5 V to approximately +12 V only power supply. Figure 2-1 shows the layout of the TMS570LS12 HDK board. Hercules TMS570LS 1227 Figure 2-1.
Connectors www.ti.com 2.2 Connectors The HDK board has 13 interfaces to various peripherals. These interfaces are described in the following sections. J7 P1 J15 J1 J4 J6 Hercules TMS570LS 1227 J10 J9 J12 J19 J11 J2 J3 Figure 2-2. Connectors on TMS570LS12 HDK Table 2-1. Connectors on HDK Board Connector Size Function J1 RJ45 Ethernet J2 3 terminal, 2.54mm DCAN1 J3 3 terminal, 2.54mm DCAN2 J4 10x2, 2.
Connectors www.ti.com 2.2.1 20-Pin ARM JTAG Header In addition to on board XDS100V2 JTAG, one 20-pin ARM JTAG header is added for using external emulator. This is the standard interface used by JTAG emulators to interface to ARM microcontrollers. The pinout for the connector is shown in Table 2-2. Table 2-2.
Connectors www.ti.com J2 J3 H L H L Figure 2-3. J2, J3 CAN Bus Interface (Screw Terminal) 2.2.4 J19, MIPI ETM Connector Figure 2-4 and Table 2-4 show the 60 pin MIPI header. Pin 1 Figure 2-4. J19, 60 Pin MIPI ETM Header Table 2-4. J19, MIPI Connector Signal Mapping MCU Signals Pin Number Pin MCU Number Signals 3.3 V 1 2 TMS TCK 3 4 TDO TDI 5 6 System reset RTCK 7 8 nTRST NC 9 10 NC NC 11 12 3.
Connectors www.ti.com Table 2-4. J19, MIPI Connector Signal Mapping (continued) MCU Signals Pin Number Pin MCU Number Signals NC 49 50 NC NC 51 52 NC NC 53 54 NC NC 55 56 NC GND 57 58 GND NC 59 60 NC 2.2.5 J7, XDS100V2 USB JTAG Interface The USB connector J7 is used to connect to the host development system that is running the software development IDE, Code Composer Studio. The signals on this connector are shown in Table 2-5. Table 2-5.
Connectors www.ti.com 2.2.8 Daughter Card Interface The HDK provides expansion connectors that can be used to accept plug-in daughter cards. The daughter card allows users to build on their EVM platform to extend its capabilities and provide customer and application specific I/O. The expansion connectors are for all major interfaces including asynchronous memory, peripherals, and A/D expansion. There are three daughter card interfaces: J9, J10, J11. These connectors are described in Table 2-6.
Connectors www.ti.com Table 2-6.
Connectors www.ti.com Table 2-7. Expansion Connector P2 (J10, Right, BottomView) (continued) Signal Name SPI2_CS0 Pin Number N3 EXP_12V Number Pin Number 63 64 65 66 E2 Signal Name SPI2_CLK GND Table 2-8.
LEDs 2.3 www.ti.com LEDs The TMS570LS12 HDK board has 19 LEDs. Eight of these LEDs (shown in Table 2-9) are under user control. Those LEDs are controlled and programmed by NHET signals. LEDs DS2, DS3, DS4, and DS5 indicate the presence of the power (+1.2 V, +5 V, 3.3 V, and 12 V) s on the board. The LED functions are summarized in Table 2-9 and Table 2-10. Table 2-9.
Jumpers www.ti.com Table 2-11. S2 DIP Switch Functions Switch (1) (2) (3) 2.5 OFF Position ON Position S2:1 (1) USB Host0 Disabled USB Host0 Enabled S2:2 (2) USB Host1 Disabled USB Host1 Enabled S2:3 (2) USB Device Disabled USB Device Enabled S2:4 (3) Ethernet Disabled Ethernet Enabled S2:1 indicates slide 1 on the S2 DIP switch, S2:2 indicates slide 2 on the S2 DIP switch, and so on. S2:2 and S2:3 cannot be enabled at the same time since those two ports have pinmux.
Appendix A SPNU568A – September 2012 – Revised September 2013 Operation Notices The user assumes all responsibility and liability for proper and safe handling of the boards. It is the user's responsibility to take any and all appropriate precautions with regard to electrostatic discharge. • For additional information regarding the embedded emulation, see the XDS100 USB wiki on the TI web site at the following URL: http://tiexpressdsp.com/index.
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods.
FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
【Important Notice for Users of EVMs for RF Products in Japan】 】 This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product: 1. 2. 3. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.
EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use.
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
