Datasheet

RM46L450
RM46L850
SPNS184A –SEPTEMBER 2012–REVISED SEPTEMBER 2013 www.ti.com
7 Mechanical Data
7.1 Thermal Data
Table 7-1 shows the thermal resistance characteristics for the QFP - PGE mechanical package.
Table 7-2 shows the thermal resistance characteristics for the BGA - ZWT mechanical package.
Table 7-1. Thermal Resistance Characteristics
(PGE Package)
PARAMETER °C / W
RΘ
JA
40
RΘ
JB
27.2
RΘ
JC
7.3
Table 7-2. Thermal Resistance Characteristics
(ZWT Package)
PARAMETER °C / W
RΘ
JA
18.8
RΘ
JB
14.1
RΘ
JC
7.1
7.2 Packaging Information
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
178 Mechanical Data Copyright © 2012–2013, Texas Instruments Incorporated
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