Datasheet
Table Of Contents
- 1 Digital Media System-on-Chip (DMSoC)
- Table of Contents
- 2 Revision History
- 3 Device Overview
- 3.1 Device Characteristics
- 3.2 Device Compatibility
- 3.3 ARM Subsystem
- 3.3.1 ARM926EJ-S RISC CPU
- 3.3.2 CP15
- 3.3.3 MMU
- 3.3.4 Caches and Write Buffer
- 3.3.5 Tightly Coupled Memory (TCM)
- 3.3.6 Advanced High-Performance Bus (AHB)
- 3.3.7 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)
- 3.3.8 ARM Memory Mapping
- 3.3.9 Peripherals
- 3.3.10 PLL Controller (PLLC)
- 3.3.11 Power and Sleep Controller (PSC)
- 3.3.12 ARM Interrupt Controller (AINTC)
- 3.3.13 System Module
- 3.3.14 Power Management
- 3.4 DSP Subsystem
- 3.5 Memory Map Summary
- 3.6 Pin Assignments
- 3.7 Terminal Functions
- 3.8 Device Support
- 3.9 Documentation Support
- 3.10 Community Resources
- 4 Device Configurations
- 4.1 System Module Registers
- 4.2 Power Considerations
- 4.3 Clock Considerations
- 4.4 Boot Sequence
- 4.5 Configurations At Reset
- 4.6 Configurations After Reset
- 4.7 Multiplexed Pin Configurations
- 4.7.1 Pin Muxing Selection At Reset
- 4.7.2 Pin Muxing Selection After Reset
- 4.7.3 Pin Multiplexing Details
- 4.7.3.1 PCI, HPI, EMIFA, and ATA Pin Muxing
- 4.7.3.2 PWM Signal Muxing
- 4.7.3.3 TSIF0 Input Signal Muxing (Serial/Parallel)
- 4.7.3.4 TSIF0 Output Signal Muxing (Serial/Parallel)
- 4.7.3.5 TSIF1 Input Signal Muxing (Serial Only)
- 4.7.3.6 TSIF1 Output Signal Muxing (Serial Only)
- 4.7.3.7 CRGEN Signal Muxing
- 4.7.3.8 UART0 Pin Muxing
- 4.7.3.9 UART1 Pin Muxing
- 4.7.3.10 UART2 Pin Muxing
- 4.7.3.11 ARM/DSP Communications Interrupts
- 4.7.3.12 Emulation Control
- 4.8 Debugging Considerations
- 5 System Interconnect
- 6 Device Operating Conditions
- 7 Peripheral Information and Electrical Specifications
- 7.1 Parameter Information
- 7.2 Recommended Clock and Control Signal Transition Behavior
- 7.3 Power Supplies
- 7.4 External Clock Input From DEV_MXI/DEV_CLKIN and AUX_MXI/AUX_CLKIN Pins
- 7.5 Clock PLLs
- 7.6 Enhanced Direct Memory Access (EDMA3) Controller
- 7.7 Reset
- 7.8 Interrupts
- 7.9 External Memory Interface (EMIF)
- 7.10 DDR2 Memory Controller
- 7.10.1 DDR2 Memory Controller Electrical Data/Timing
- 7.10.2 DDR2 Interface
- 7.10.2.1 DDR2 Interface Schematic
- 7.10.2.2 Compatible JEDEC DDR2 Devices
- 7.10.2.3 PCB Stackup
- 7.10.2.4 Placement
- 7.10.2.5 DDR2 Keep Out Region
- 7.10.2.6 Bulk Bypass Capacitors
- 7.10.2.7 High-Speed Bypass Capacitors
- 7.10.2.8 Net Classes
- 7.10.2.9 DDR2 Signal Termination
- 7.10.2.10 VREF Routing
- 7.10.2.11 DDR2 CK and ADDR_CTRL Routing
- 7.11 Video Port Interface (VPIF)
- 7.12 Transport Stream Interface (TSIF)
- 7.13 Clock Recovery Generator (CRGEN)
- 7.14 Video Data Conversion Engine (VDCE)
- 7.15 Peripheral Component Interconnect (PCI)
- 7.16 Ethernet MAC (EMAC)
- 7.17 Management Data Input/Output (MDIO)
- 7.18 Host-Port Interface (HPI) Peripheral
- 7.19 USB 2.0 [see Note]
- 7.20 ATA Controller
- 7.21 VLYNQ
- 7.22 Multichannel Audio Serial Port (McASP0/1) Peripherals
- 7.23 Serial Peripheral Interface (SPI)
- 7.24 Universal Asynchronouse Receiver/Transmitter (UART)
- 7.25 Inter-Integrated Circuit (I2C)
- 7.26 Pulse Width Modulator (PWM)
- 7.27 Timers
- 7.28 General-Purpose Input/Output (GPIO)
- 7.29 IEEE 1149.1 JTAG
- 8 Mechanical Packaging and Orderable Information
TMS320DM6467T
SPRS605C –JULY 2009–REVISED JUNE 2012
www.ti.com
Table 7-92. Timings for ATA Module — Ultra DMA AC Timing
(1) (2)
(see Figure 7-66 through Figure 7-75) (continued)
-1G
NO. UNIT
MODE MIN MAX
0 230 ns
1 200 ns
2 170 ns
14 t
FS
First STROBE time
3 130 ns
4 120 ns
5 90 ns
0-2 0 150 ns
15 t
LI
Limited interlock time 3-4 0 100 ns
5 0 75 ns
16 t
MLI
Interlock time with minimum 0-5 20 ns
17 t
UI
Unlimited interlock time 0-5 0 ns
Maximum time allowed for output drivers to
18 t
AZ
0-5 10 ns
release
19 t
ZAH
Minimum delay time required for output 0-5 20 ns
Minimum delay time for driver to assert or negate
20 t
ZAD
0-5 0 ns
(from released)
Envelope time, DMACK to STOP and DMACK to
21 t
ENV
HDMARDY during in-burst initiation and from 0-5 (TENV + 1)P - 0.5 (TENV + 1)P + 1.4 ns
DMACK to STOP during data out burst initiation
0 75 ns
1 70 ns
22 t
RFS
Ready-to-final-STROBE time
2-4 60 ns
5 50 ns
Ready to pause time, (HDMARDY (DIOR) to
0-5 (UDMATRP + 1)P - 0.8 ns
STOP (DIOW))
0 160 ns
23 t
RP
1 125 ns
Ready to pause time, (DDMARDY (IORDY) to
DMARQ)
2-4 100 ns
5 85 ns
24 t
IORDYZ
Maximum time before releasing IORDY 0-5 20 ns
25 t
ZIORDY
Minimum time before driving IORDY 0-5 0 ns
Setup and hold time for DMACK (before
26 t
ACK
0-5 20 ns
assertion or negation)
STROBE edge to negation of DMARQ or
27 t
SS
assertion of STOP (when sender terminates a 0-5 50 ns
burst)
286 Peripheral Information and Electrical Specifications Copyright © 2009–2012, Texas Instruments Incorporated
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