Datasheet
Table Of Contents
- 1 Digital Media System-on-Chip (DMSoC)
- Table of Contents
- 2 Revision History
- 3 Device Overview
- 3.1 Device Characteristics
- 3.2 Device Compatibility
- 3.3 ARM Subsystem
- 3.3.1 ARM926EJ-S RISC CPU
- 3.3.2 CP15
- 3.3.3 MMU
- 3.3.4 Caches and Write Buffer
- 3.3.5 Tightly Coupled Memory (TCM)
- 3.3.6 Advanced High-Performance Bus (AHB)
- 3.3.7 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)
- 3.3.8 ARM Memory Mapping
- 3.3.9 Peripherals
- 3.3.10 PLL Controller (PLLC)
- 3.3.11 Power and Sleep Controller (PSC)
- 3.3.12 ARM Interrupt Controller (AINTC)
- 3.3.13 System Module
- 3.3.14 Power Management
- 3.4 DSP Subsystem
- 3.5 Memory Map Summary
- 3.6 Pin Assignments
- 3.7 Terminal Functions
- 3.8 Device Support
- 3.9 Documentation Support
- 3.10 Community Resources
- 4 Device Configurations
- 4.1 System Module Registers
- 4.2 Power Considerations
- 4.3 Clock Considerations
- 4.4 Boot Sequence
- 4.5 Configurations At Reset
- 4.6 Configurations After Reset
- 4.7 Multiplexed Pin Configurations
- 4.7.1 Pin Muxing Selection At Reset
- 4.7.2 Pin Muxing Selection After Reset
- 4.7.3 Pin Multiplexing Details
- 4.7.3.1 PCI, HPI, EMIFA, and ATA Pin Muxing
- 4.7.3.2 PWM Signal Muxing
- 4.7.3.3 TSIF0 Input Signal Muxing (Serial/Parallel)
- 4.7.3.4 TSIF0 Output Signal Muxing (Serial/Parallel)
- 4.7.3.5 TSIF1 Input Signal Muxing (Serial Only)
- 4.7.3.6 TSIF1 Output Signal Muxing (Serial Only)
- 4.7.3.7 CRGEN Signal Muxing
- 4.7.3.8 UART0 Pin Muxing
- 4.7.3.9 UART1 Pin Muxing
- 4.7.3.10 UART2 Pin Muxing
- 4.7.3.11 ARM/DSP Communications Interrupts
- 4.7.3.12 Emulation Control
- 4.8 Debugging Considerations
- 5 System Interconnect
- 6 Device Operating Conditions
- 7 Peripheral Information and Electrical Specifications
- 7.1 Parameter Information
- 7.2 Recommended Clock and Control Signal Transition Behavior
- 7.3 Power Supplies
- 7.4 External Clock Input From DEV_MXI/DEV_CLKIN and AUX_MXI/AUX_CLKIN Pins
- 7.5 Clock PLLs
- 7.6 Enhanced Direct Memory Access (EDMA3) Controller
- 7.7 Reset
- 7.8 Interrupts
- 7.9 External Memory Interface (EMIF)
- 7.10 DDR2 Memory Controller
- 7.10.1 DDR2 Memory Controller Electrical Data/Timing
- 7.10.2 DDR2 Interface
- 7.10.2.1 DDR2 Interface Schematic
- 7.10.2.2 Compatible JEDEC DDR2 Devices
- 7.10.2.3 PCB Stackup
- 7.10.2.4 Placement
- 7.10.2.5 DDR2 Keep Out Region
- 7.10.2.6 Bulk Bypass Capacitors
- 7.10.2.7 High-Speed Bypass Capacitors
- 7.10.2.8 Net Classes
- 7.10.2.9 DDR2 Signal Termination
- 7.10.2.10 VREF Routing
- 7.10.2.11 DDR2 CK and ADDR_CTRL Routing
- 7.11 Video Port Interface (VPIF)
- 7.12 Transport Stream Interface (TSIF)
- 7.13 Clock Recovery Generator (CRGEN)
- 7.14 Video Data Conversion Engine (VDCE)
- 7.15 Peripheral Component Interconnect (PCI)
- 7.16 Ethernet MAC (EMAC)
- 7.17 Management Data Input/Output (MDIO)
- 7.18 Host-Port Interface (HPI) Peripheral
- 7.19 USB 2.0 [see Note]
- 7.20 ATA Controller
- 7.21 VLYNQ
- 7.22 Multichannel Audio Serial Port (McASP0/1) Peripherals
- 7.23 Serial Peripheral Interface (SPI)
- 7.24 Universal Asynchronouse Receiver/Transmitter (UART)
- 7.25 Inter-Integrated Circuit (I2C)
- 7.26 Pulse Width Modulator (PWM)
- 7.27 Timers
- 7.28 General-Purpose Input/Output (GPIO)
- 7.29 IEEE 1149.1 JTAG
- 8 Mechanical Packaging and Orderable Information

TMS320DM6467T
www.ti.com
SPRS605C –JULY 2009–REVISED JUNE 2012
7.16 Ethernet MAC (EMAC)
The Ethernet Media Access Controller (EMAC) module provides an efficient interface between the
DM6467T and the networked community. The EMAC supports 10Base-T (10 Mbits/second [Mbps]), and
100BaseTX (100 Mbps), in either half- or full-duplex mode, and 1000BaseT (1000 Mbps) in full-duplex
mode, with hardware flow control and quality-of-service (QOS) support.
The EMAC controls the flow of packet data from the DM6467T device to the PHY. The MDIO module
controls the PHY configuration and status monitoring.
The EMAC module conforms to the IEEE 802.3-2002 standard, describing the “Carrier Sense Multiple
Access with Collision Detection (CSMA/CD) Access Method and Physical Layer” specifications. The IEEE
802.3 standard has also been adopted by ISO/IEC and re-designated as ISO/IEC 8802-3:2000(E).
Deviating from this standard, the EMAC module does not use the Transmit Coding Error signal MTXER.
Instead of driving the error pin when an underflow condition occurs on a transmitted frame, the EMAC will
intentionally generate an incorrect checksum by inverting the frame CRC, so that the transmitted frame
will be detected as an error by the network. In addition, the EMAC I/Os operate at 3.3 V and are not
compatible with 2.5-V I/O signaling. Therefore, only Ethernet PHYs with 3.3-V I/O interface should be
used.
Both the EMAC and MDIO modules interface to the DM6467T device through a custom interface that
allows efficient data transmission and reception. This custom interface is referred to as the EMAC control
module. The EMAC control module contains the necessary components to allow the EMAC to make
efficient use of device memory, plus it controls device interrupts. The EMAC control module incorporates
8K bytes of internal RAM to hold EMAC buffer descriptors.
For more detailed information on the EMAC, see the TMS320DM646x DMSoC Ethernet Media Access
Controller (EMAC)/Management Data Input/Output (MDIO) Module User's Guide (literature number
SPRUEQ6).
7.16.1 EMAC Device-Specific Information
The EMAC module on the DM6467T supports two interface modes: Media Independent Interface (MII) and
Gigabit Media Independent Interface (GMII). The MII and GMII interface modes are defined in the IEEE
802.3-2002 standard.
The DM6467T EMAC uses the same pins for the MII and GMII modes of operation. Only one mode can
be used at a time. The mode used is selected at device reset based on the GMIIEN bit in the
MACCONTROL register. For more detailed information on the EMAC GMIIEN bit, see the
TMS320DM646x DMSoC Ethernet Media Access Controller (EMAC)/Management Data Input/Output
(MDIO) Module User's Guide (literature number SPRUEQ6).
The MII and GMII modes-of-operation pins are as follows:
• MII: MTCLK, MRCLK, MTXD[3:0], MRXD[3:0], MTXEN, MRXDV, MRXER, MCOL, MCRS, MDCLK,
and MDIO.
• GMII: RFTCLK, GMTCLK, MTCLK, MRCLK, MTXD[7:0], MRXD[7:0], MTXEN, MRXDV, MRXER,
MCOL, MCRS, MDCLK, and MDIO.
Copyright © 2009–2012, Texas Instruments Incorporated Peripheral Information and Electrical Specifications 249
Submit Documentation Feedback
Product Folder Link(s): TMS320DM6467T