Datasheet
Table Of Contents
- 1 Digital Media System-on-Chip (DMSoC)
- Table of Contents
- 2 Revision History
- 3 Device Overview
- 3.1 Device Characteristics
- 3.2 Device Compatibility
- 3.3 ARM Subsystem
- 3.3.1 ARM926EJ-S RISC CPU
- 3.3.2 CP15
- 3.3.3 MMU
- 3.3.4 Caches and Write Buffer
- 3.3.5 Tightly Coupled Memory (TCM)
- 3.3.6 Advanced High-Performance Bus (AHB)
- 3.3.7 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)
- 3.3.8 ARM Memory Mapping
- 3.3.9 Peripherals
- 3.3.10 PLL Controller (PLLC)
- 3.3.11 Power and Sleep Controller (PSC)
- 3.3.12 ARM Interrupt Controller (AINTC)
- 3.3.13 System Module
- 3.3.14 Power Management
- 3.4 DSP Subsystem
- 3.5 Memory Map Summary
- 3.6 Pin Assignments
- 3.7 Terminal Functions
- 3.8 Device Support
- 3.9 Documentation Support
- 3.10 Community Resources
- 4 Device Configurations
- 4.1 System Module Registers
- 4.2 Power Considerations
- 4.3 Clock Considerations
- 4.4 Boot Sequence
- 4.5 Configurations At Reset
- 4.6 Configurations After Reset
- 4.7 Multiplexed Pin Configurations
- 4.7.1 Pin Muxing Selection At Reset
- 4.7.2 Pin Muxing Selection After Reset
- 4.7.3 Pin Multiplexing Details
- 4.7.3.1 PCI, HPI, EMIFA, and ATA Pin Muxing
- 4.7.3.2 PWM Signal Muxing
- 4.7.3.3 TSIF0 Input Signal Muxing (Serial/Parallel)
- 4.7.3.4 TSIF0 Output Signal Muxing (Serial/Parallel)
- 4.7.3.5 TSIF1 Input Signal Muxing (Serial Only)
- 4.7.3.6 TSIF1 Output Signal Muxing (Serial Only)
- 4.7.3.7 CRGEN Signal Muxing
- 4.7.3.8 UART0 Pin Muxing
- 4.7.3.9 UART1 Pin Muxing
- 4.7.3.10 UART2 Pin Muxing
- 4.7.3.11 ARM/DSP Communications Interrupts
- 4.7.3.12 Emulation Control
- 4.8 Debugging Considerations
- 5 System Interconnect
- 6 Device Operating Conditions
- 7 Peripheral Information and Electrical Specifications
- 7.1 Parameter Information
- 7.2 Recommended Clock and Control Signal Transition Behavior
- 7.3 Power Supplies
- 7.4 External Clock Input From DEV_MXI/DEV_CLKIN and AUX_MXI/AUX_CLKIN Pins
- 7.5 Clock PLLs
- 7.6 Enhanced Direct Memory Access (EDMA3) Controller
- 7.7 Reset
- 7.8 Interrupts
- 7.9 External Memory Interface (EMIF)
- 7.10 DDR2 Memory Controller
- 7.10.1 DDR2 Memory Controller Electrical Data/Timing
- 7.10.2 DDR2 Interface
- 7.10.2.1 DDR2 Interface Schematic
- 7.10.2.2 Compatible JEDEC DDR2 Devices
- 7.10.2.3 PCB Stackup
- 7.10.2.4 Placement
- 7.10.2.5 DDR2 Keep Out Region
- 7.10.2.6 Bulk Bypass Capacitors
- 7.10.2.7 High-Speed Bypass Capacitors
- 7.10.2.8 Net Classes
- 7.10.2.9 DDR2 Signal Termination
- 7.10.2.10 VREF Routing
- 7.10.2.11 DDR2 CK and ADDR_CTRL Routing
- 7.11 Video Port Interface (VPIF)
- 7.12 Transport Stream Interface (TSIF)
- 7.13 Clock Recovery Generator (CRGEN)
- 7.14 Video Data Conversion Engine (VDCE)
- 7.15 Peripheral Component Interconnect (PCI)
- 7.16 Ethernet MAC (EMAC)
- 7.17 Management Data Input/Output (MDIO)
- 7.18 Host-Port Interface (HPI) Peripheral
- 7.19 USB 2.0 [see Note]
- 7.20 ATA Controller
- 7.21 VLYNQ
- 7.22 Multichannel Audio Serial Port (McASP0/1) Peripherals
- 7.23 Serial Peripheral Interface (SPI)
- 7.24 Universal Asynchronouse Receiver/Transmitter (UART)
- 7.25 Inter-Integrated Circuit (I2C)
- 7.26 Pulse Width Modulator (PWM)
- 7.27 Timers
- 7.28 General-Purpose Input/Output (GPIO)
- 7.29 IEEE 1149.1 JTAG
- 8 Mechanical Packaging and Orderable Information
DDR_D0
DDR_D7
DDR_DQM0
DDR_DQS0
DDR_DQS0
DDR_D8
DDR_D15
DDR_DQM1
DDR_DQS1
DDR_DQS1
DQ0
DQ7
LDM
LDQS
LDQS
DQ8
DQ15
UDM
UDQS
UDQS
BA0
BA2
A0
A14
CS
CAS
RAS
WE
CKE
CK
CK
VREF
DDR_D16
DDR_D23
DDR_DQM2
DDR_DQS2
DDR_DQS2
DDR_D24
DDR_D31
DDR_DQM3
DDR_DQS3
DDR_DQS3
DDR_BA0
DDR_BA2
DDR_A0
DDR_A14
DDR_CS
DDR_CAS
DDR_RAS
DDR_WE
DDR_CKE
DDR_CLK
DDR_CLK
DDR_VREF
1 K Ω 1%
Vio 1.8
(A)
DDR2
DDR_DQGATE0
DDR_DQGATE1
DDR_DQGATE2
DDR_DQGATE3
VREF
Terminator, if desired. See terminator comments.
A Vio1.8 is the power supply for the DDR2 memories and DM646x DDR2 interface.
B One of these capacitors can be eliminated if the divider and its capacitors are placed near a device VREF pin.
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
0.1 µF
VREF
0.1 µF
1 K Ω 1%
0.1 µF
(B)
0.1 µF
(B)
DDR_ODT0
NC
ODT
DM646x
NC
NC
NC
NC
1 KΩ
NC
NC
1 KΩ
1 KΩ
1 KΩ
T
T
T
DDR_ZP
DDR_ZN
50 ( 5%)Ω ±
50 ( 5%)Ω ±
Vio 1.8
(A)
Vio 1.8
(A)
DV
DDR2
TMS320DM6467T
SPRS605C –JULY 2009–REVISED JUNE 2012
www.ti.com
Figure 7-27. DM6467T 16-Bit DDR2 High Level Schematic
Table 7-34. PCB Stack Up Specifications
No. Parameter Min Typ Max Unit
1 PCB Routing/Plane Layers 6
210 Peripheral Information and Electrical Specifications Copyright © 2009–2012, Texas Instruments Incorporated
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