Datasheet
Table Of Contents
- 1 Digital Media System-on-Chip (DMSoC)
- Table of Contents
- 2 Revision History
- 3 Device Overview
- 3.1 Device Characteristics
- 3.2 Device Compatibility
- 3.3 ARM Subsystem
- 3.3.1 ARM926EJ-S RISC CPU
- 3.3.2 CP15
- 3.3.3 MMU
- 3.3.4 Caches and Write Buffer
- 3.3.5 Tightly Coupled Memory (TCM)
- 3.3.6 Advanced High-Performance Bus (AHB)
- 3.3.7 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)
- 3.3.8 ARM Memory Mapping
- 3.3.9 Peripherals
- 3.3.10 PLL Controller (PLLC)
- 3.3.11 Power and Sleep Controller (PSC)
- 3.3.12 ARM Interrupt Controller (AINTC)
- 3.3.13 System Module
- 3.3.14 Power Management
- 3.4 DSP Subsystem
- 3.5 Memory Map Summary
- 3.6 Pin Assignments
- 3.7 Terminal Functions
- 3.8 Device Support
- 3.9 Documentation Support
- 3.10 Community Resources
- 4 Device Configurations
- 4.1 System Module Registers
- 4.2 Power Considerations
- 4.3 Clock Considerations
- 4.4 Boot Sequence
- 4.5 Configurations At Reset
- 4.6 Configurations After Reset
- 4.7 Multiplexed Pin Configurations
- 4.7.1 Pin Muxing Selection At Reset
- 4.7.2 Pin Muxing Selection After Reset
- 4.7.3 Pin Multiplexing Details
- 4.7.3.1 PCI, HPI, EMIFA, and ATA Pin Muxing
- 4.7.3.2 PWM Signal Muxing
- 4.7.3.3 TSIF0 Input Signal Muxing (Serial/Parallel)
- 4.7.3.4 TSIF0 Output Signal Muxing (Serial/Parallel)
- 4.7.3.5 TSIF1 Input Signal Muxing (Serial Only)
- 4.7.3.6 TSIF1 Output Signal Muxing (Serial Only)
- 4.7.3.7 CRGEN Signal Muxing
- 4.7.3.8 UART0 Pin Muxing
- 4.7.3.9 UART1 Pin Muxing
- 4.7.3.10 UART2 Pin Muxing
- 4.7.3.11 ARM/DSP Communications Interrupts
- 4.7.3.12 Emulation Control
- 4.8 Debugging Considerations
- 5 System Interconnect
- 6 Device Operating Conditions
- 7 Peripheral Information and Electrical Specifications
- 7.1 Parameter Information
- 7.2 Recommended Clock and Control Signal Transition Behavior
- 7.3 Power Supplies
- 7.4 External Clock Input From DEV_MXI/DEV_CLKIN and AUX_MXI/AUX_CLKIN Pins
- 7.5 Clock PLLs
- 7.6 Enhanced Direct Memory Access (EDMA3) Controller
- 7.7 Reset
- 7.8 Interrupts
- 7.9 External Memory Interface (EMIF)
- 7.10 DDR2 Memory Controller
- 7.10.1 DDR2 Memory Controller Electrical Data/Timing
- 7.10.2 DDR2 Interface
- 7.10.2.1 DDR2 Interface Schematic
- 7.10.2.2 Compatible JEDEC DDR2 Devices
- 7.10.2.3 PCB Stackup
- 7.10.2.4 Placement
- 7.10.2.5 DDR2 Keep Out Region
- 7.10.2.6 Bulk Bypass Capacitors
- 7.10.2.7 High-Speed Bypass Capacitors
- 7.10.2.8 Net Classes
- 7.10.2.9 DDR2 Signal Termination
- 7.10.2.10 VREF Routing
- 7.10.2.11 DDR2 CK and ADDR_CTRL Routing
- 7.11 Video Port Interface (VPIF)
- 7.12 Transport Stream Interface (TSIF)
- 7.13 Clock Recovery Generator (CRGEN)
- 7.14 Video Data Conversion Engine (VDCE)
- 7.15 Peripheral Component Interconnect (PCI)
- 7.16 Ethernet MAC (EMAC)
- 7.17 Management Data Input/Output (MDIO)
- 7.18 Host-Port Interface (HPI) Peripheral
- 7.19 USB 2.0 [see Note]
- 7.20 ATA Controller
- 7.21 VLYNQ
- 7.22 Multichannel Audio Serial Port (McASP0/1) Peripherals
- 7.23 Serial Peripheral Interface (SPI)
- 7.24 Universal Asynchronouse Receiver/Transmitter (UART)
- 7.25 Inter-Integrated Circuit (I2C)
- 7.26 Pulse Width Modulator (PWM)
- 7.27 Timers
- 7.28 General-Purpose Input/Output (GPIO)
- 7.29 IEEE 1149.1 JTAG
- 8 Mechanical Packaging and Orderable Information
DDR_D0
DDR_D7
DDR_DQM0
DDR_DQS0
DDR_DQS0
DDR_D8
DDR_D15
DDR_DQM1
DDR_DQS1
DDR_DQS1
DQ0
DQ7
LDM
LDQS
LDQS
DQ8
DQ15
UDM
UDQS
UDQS
BA0
BA2
A0
A14
CS
CAS
RAS
WE
CKE
CK
CK
VREF
DQ0
DQ7
LDM
LDQS
LDQS
DQ8
DQ15
UDM
UDQS
UDQS
BA0
BA2
A0
A14
CS
CAS
RAS
WE
CKE
CK
CK
VREF
DDR_D16
DDR_D23
DDR_DQM2
DDR_DQS2
DDR_DQS2
DDR_D24
DDR_D31
DDR_DQM3
DDR_DQS3
DDR_DQS3
DDR_BA0
DDR_BA2
DDR_A0
DDR_A14
DDR_CS
DDR_CAS
DDR_RAS
DDR_WE
DDR_CKE
DDR_CLK
DDR_CLK
ODT
DDR_VREF
1 K Ω 1%
Vio 1.8
(A)
DDR2
DDR2
DDR_DQGATE0
DDR_DQGATE1
DDR_DQGATE2
DDR_DQGATE3
VREF
Terminator, if desired. See terminator comments.
A Vio1.8 is the power supply for the DDR2 memories and DM646x DDR2 interface.
B One of these capacitors can be eliminated if the divider and its capacitors are placed near a device VREF pin.
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
0.1 µF
VREF VREF
0.1 µF
1 K Ω 1%
0.1 µF
(B)
0.1 µF
(B)
DDR_ODT0
NC
ODT
DM646x
50 Ω (±5%)
50 Ω (±5%)
T
T
T
DDR_ZN
DDR_ZP
0.1 µF
(B)
DV
DDR2
TMS320DM6467T
www.ti.com
SPRS605C –JULY 2009–REVISED JUNE 2012
Complete stack up specifications are provided in Table 7-34.
Figure 7-26. DM6467T 32-Bit DDR2 High Level Schematic
Copyright © 2009–2012, Texas Instruments Incorporated Peripheral Information and Electrical Specifications 209
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