Datasheet
Table Of Contents
- 1 Digital Media System-on-Chip (DMSoC)
- Table of Contents
- 2 Revision History
- 3 Device Overview
- 3.1 Device Characteristics
- 3.2 Device Compatibility
- 3.3 ARM Subsystem
- 3.3.1 ARM926EJ-S RISC CPU
- 3.3.2 CP15
- 3.3.3 MMU
- 3.3.4 Caches and Write Buffer
- 3.3.5 Tightly Coupled Memory (TCM)
- 3.3.6 Advanced High-Performance Bus (AHB)
- 3.3.7 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)
- 3.3.8 ARM Memory Mapping
- 3.3.9 Peripherals
- 3.3.10 PLL Controller (PLLC)
- 3.3.11 Power and Sleep Controller (PSC)
- 3.3.12 ARM Interrupt Controller (AINTC)
- 3.3.13 System Module
- 3.3.14 Power Management
- 3.4 DSP Subsystem
- 3.5 Memory Map Summary
- 3.6 Pin Assignments
- 3.7 Terminal Functions
- 3.8 Device Support
- 3.9 Documentation Support
- 3.10 Community Resources
- 4 Device Configurations
- 4.1 System Module Registers
- 4.2 Power Considerations
- 4.3 Clock Considerations
- 4.4 Boot Sequence
- 4.5 Configurations At Reset
- 4.6 Configurations After Reset
- 4.7 Multiplexed Pin Configurations
- 4.7.1 Pin Muxing Selection At Reset
- 4.7.2 Pin Muxing Selection After Reset
- 4.7.3 Pin Multiplexing Details
- 4.7.3.1 PCI, HPI, EMIFA, and ATA Pin Muxing
- 4.7.3.2 PWM Signal Muxing
- 4.7.3.3 TSIF0 Input Signal Muxing (Serial/Parallel)
- 4.7.3.4 TSIF0 Output Signal Muxing (Serial/Parallel)
- 4.7.3.5 TSIF1 Input Signal Muxing (Serial Only)
- 4.7.3.6 TSIF1 Output Signal Muxing (Serial Only)
- 4.7.3.7 CRGEN Signal Muxing
- 4.7.3.8 UART0 Pin Muxing
- 4.7.3.9 UART1 Pin Muxing
- 4.7.3.10 UART2 Pin Muxing
- 4.7.3.11 ARM/DSP Communications Interrupts
- 4.7.3.12 Emulation Control
- 4.8 Debugging Considerations
- 5 System Interconnect
- 6 Device Operating Conditions
- 7 Peripheral Information and Electrical Specifications
- 7.1 Parameter Information
- 7.2 Recommended Clock and Control Signal Transition Behavior
- 7.3 Power Supplies
- 7.4 External Clock Input From DEV_MXI/DEV_CLKIN and AUX_MXI/AUX_CLKIN Pins
- 7.5 Clock PLLs
- 7.6 Enhanced Direct Memory Access (EDMA3) Controller
- 7.7 Reset
- 7.8 Interrupts
- 7.9 External Memory Interface (EMIF)
- 7.10 DDR2 Memory Controller
- 7.10.1 DDR2 Memory Controller Electrical Data/Timing
- 7.10.2 DDR2 Interface
- 7.10.2.1 DDR2 Interface Schematic
- 7.10.2.2 Compatible JEDEC DDR2 Devices
- 7.10.2.3 PCB Stackup
- 7.10.2.4 Placement
- 7.10.2.5 DDR2 Keep Out Region
- 7.10.2.6 Bulk Bypass Capacitors
- 7.10.2.7 High-Speed Bypass Capacitors
- 7.10.2.8 Net Classes
- 7.10.2.9 DDR2 Signal Termination
- 7.10.2.10 VREF Routing
- 7.10.2.11 DDR2 CK and ADDR_CTRL Routing
- 7.11 Video Port Interface (VPIF)
- 7.12 Transport Stream Interface (TSIF)
- 7.13 Clock Recovery Generator (CRGEN)
- 7.14 Video Data Conversion Engine (VDCE)
- 7.15 Peripheral Component Interconnect (PCI)
- 7.16 Ethernet MAC (EMAC)
- 7.17 Management Data Input/Output (MDIO)
- 7.18 Host-Port Interface (HPI) Peripheral
- 7.19 USB 2.0 [see Note]
- 7.20 ATA Controller
- 7.21 VLYNQ
- 7.22 Multichannel Audio Serial Port (McASP0/1) Peripherals
- 7.23 Serial Peripheral Interface (SPI)
- 7.24 Universal Asynchronouse Receiver/Transmitter (UART)
- 7.25 Inter-Integrated Circuit (I2C)
- 7.26 Pulse Width Modulator (PWM)
- 7.27 Timers
- 7.28 General-Purpose Input/Output (GPIO)
- 7.29 IEEE 1149.1 JTAG
- 8 Mechanical Packaging and Orderable Information

TMS320DM6467T
SPRS605C –JULY 2009–REVISED JUNE 2012
www.ti.com
Table 7-29. Switching Characteristics Over Recommended Operating Conditions for Asynchronous
Memory Cycles for EMIFA Module
(1) (2)
(see Figure 7-21 and Figure 7-22)
-1G
NO. PARAMETER UNIT
MIN MAX
READS and WRITES
1 t
d(TURNAROUND)
Turn around time (TA + 1) * E - 3 (TA + 1) * E + 3 ns
READS
(RS + RST + RH + (RS + RST + RH + TA +
EMIF read cycle time (EW = 0) ns
TA + 4) * E - 3 4) * E + 3
3 t
c(EMRCYCLE)
(RS + RST + RH +
EMIF read cycle time (EW = 1) 4184 * E + 3 ns
TA + 4) * E - 3
Output setup time, EM_CS[5:2] low to EM_OE low
(RS + 1) * E - 3 (RS + 1) * E + 3 ns
(SS = 0)
4 t
su(EMCSL-EMOEL)
Output setup time, EM_CS[5:2] low to EM_OE low
3 ns
(SS = 1)
Output hold time, EM_OE high to EM_CS[5:2] high
(RH + 1) * E - 3 (RH + 1) * E + 3 ns
(SS = 0)
5 t
h(EMOEH-EMCSH)
Output hold time, EM_OE high to EM_CS[5:2] high
3 ns
(SS = 1)
6 t
su(EMBAV-EMOEL)
Output setup time, EM_BA[1:0] valid to EM_OE low (RS + 1) * E - 3 (RS + 1) * E + 3 ns
7 t
h(EMOEH-EMBAIV)
Output hold time, EM_OE high to EM_BA[1:0] invalid (RH + 1) * E - 3 (RH + 1) * E + 3 ns
8 t
su(EMBAV-EMOEL)
Output setup time, EM_A[22:0] valid to EM_OE low (RS + 1) * E - 3 (RS + 1) * E + 3 ns
9 t
h(EMOEH-EMBAIV)
Output hold time, EM_OE high to EM_A[22:0] invalid (RH + 1) * E - 3 (RH + 1) * E + 3 ns
EM_OE active low width (EW = 0) (RST + 1) * E - 3 (RST + 1) * E + 3 ns
10 t
w(EMOEL)
EM_OE active low width (EW = 1) (RST + 1) * E - 3 (RST + 4097) * E + 3 ns
11 t
d(EMWAITH-EMOEH)
Delay time from EM_WAITx deasserted to EM_OE high 4E + 3 ns
WRITES
(WS + WST + WH (WS + WST + WH + TA
EMIF write cycle time (EW = 0) ns
+ TA + 4) * E - 3 + 4) * E + 3
15 t
c(EMWCYCLE)
(WS + WST + WH
EMIF write cycle time (EW = 1) 4184 * E + 3 ns
+ TA + 4) * E - 3
Output setup time, EM_CS[5:2] low to EM_WE low
(WS + 1) * E - 3 (WS + 1) * E + 3 ns
(SS = 0)
16 t
su(EMCSL-EMWEL)
Output setup time, EM_CS[5:2] low to EM_WE low
3 ns
(SS = 1)
Output hold time, EM_WE high to EM_CS[5:2] high
(WH + 1) * E - 3 (WH + 1) * E + 3 ns
(SS = 0)
17 t
h(EMWEH-EMCSH)
Output hold time, EM_WE high to EM_CS[5:2] high
3 ns
(SS = 1)
18 t
su(EMRNW-EMWEL)
Output setup time, EM_R/W valid to EM_WE low (WS + 1) * E - 3 (WS + 1) * E + 3 ns
19 t
h(EMWEH-EMRNW)
Output hold time, EM_WE high to EM_R/W invalid (WH + 1) * E - 3 (WH + 1) * E + 3 ns
20 t
su(EMBAV-EMWEL)
Output setup time, EM_BA[1:0] valid to EM_WE low (WS + 1) * E - 3 (WS + 1) * E + 3 ns
21 t
h(EMWEH-EMBAIV)
Output hold time, EM_WE high to EM_BA[1:0] invalid (WH + 1) * E - 3 (WH + 1) * E + 3 ns
22 t
su(EMAV-EMWEL)
Output setup time, EM_A[22:0] valid to EM_WE low (WS + 1) * E - 3 (WS + 1) * E + 3 ns
23 t
h(EMWEH-EMAIV)
Output hold time, EM_WE high to EM_A[22:0] invalid (WH + 1) * E - 3 (WH + 1) * E + 3 ns
EM_WE active low width (EW = 0) (WST + 1) * E - 3 (WST + 1) * E + 3 ns
24 t
w(EMWEL)
EM_WE active low width (EW = 1) (WST + 1) * E - 3 (WST + 4097) * E + 3 ns
25 t
d(EMWAITH-EMWEH)
Delay time from EM_WAITx deasserted to EM_WE high 4E + 3 ns
26 t
su(EMDV-EMWEL)
Output setup time, EM_D[15:0] valid to EM_WE low (WS + 1) * E - 3 (WS + 1) * E + 3 ns
(1) RS = Read setup, RST = Read Strobe, RH = Read Hold, WS = Write Setup, WST = Write Strobe, WH = Write Hold, TA = Turn Around,
EW = Extend Wait mode, SS = Select Strobe mode. These parameters are programmed via the Asynchronous n Configuration and the
Asynchronous Wait Cycle Configuration registers and support the following range of values: TA[0–3], RS[0–15], RST[0–63], RH[0–7],
WS[0–15], WST[0–63], WH[0–7], EW[0–1], and MEWC[0–255]. For more information, see the TMS320DM646x DMSoC Asynchronous
External Memory Interface (EMIF) User's Guide (literature number SPRUEQ7).
(2) E = SYSCLK3 period in ns for EMIFA. For example, when running the DSP CPU at 1 GHz, use E = 4 ns.
202 Peripheral Information and Electrical Specifications Copyright © 2009–2012, Texas Instruments Incorporated
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