Datasheet
Table Of Contents
- 1 Digital Media System-on-Chip (DMSoC)
- Table of Contents
- 2 Revision History
- 3 Device Overview
- 3.1 Device Characteristics
- 3.2 Device Compatibility
- 3.3 ARM Subsystem
- 3.3.1 ARM926EJ-S RISC CPU
- 3.3.2 CP15
- 3.3.3 MMU
- 3.3.4 Caches and Write Buffer
- 3.3.5 Tightly Coupled Memory (TCM)
- 3.3.6 Advanced High-Performance Bus (AHB)
- 3.3.7 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)
- 3.3.8 ARM Memory Mapping
- 3.3.9 Peripherals
- 3.3.10 PLL Controller (PLLC)
- 3.3.11 Power and Sleep Controller (PSC)
- 3.3.12 ARM Interrupt Controller (AINTC)
- 3.3.13 System Module
- 3.3.14 Power Management
- 3.4 DSP Subsystem
- 3.5 Memory Map Summary
- 3.6 Pin Assignments
- 3.7 Terminal Functions
- 3.8 Device Support
- 3.9 Documentation Support
- 3.10 Community Resources
- 4 Device Configurations
- 4.1 System Module Registers
- 4.2 Power Considerations
- 4.3 Clock Considerations
- 4.4 Boot Sequence
- 4.5 Configurations At Reset
- 4.6 Configurations After Reset
- 4.7 Multiplexed Pin Configurations
- 4.7.1 Pin Muxing Selection At Reset
- 4.7.2 Pin Muxing Selection After Reset
- 4.7.3 Pin Multiplexing Details
- 4.7.3.1 PCI, HPI, EMIFA, and ATA Pin Muxing
- 4.7.3.2 PWM Signal Muxing
- 4.7.3.3 TSIF0 Input Signal Muxing (Serial/Parallel)
- 4.7.3.4 TSIF0 Output Signal Muxing (Serial/Parallel)
- 4.7.3.5 TSIF1 Input Signal Muxing (Serial Only)
- 4.7.3.6 TSIF1 Output Signal Muxing (Serial Only)
- 4.7.3.7 CRGEN Signal Muxing
- 4.7.3.8 UART0 Pin Muxing
- 4.7.3.9 UART1 Pin Muxing
- 4.7.3.10 UART2 Pin Muxing
- 4.7.3.11 ARM/DSP Communications Interrupts
- 4.7.3.12 Emulation Control
- 4.8 Debugging Considerations
- 5 System Interconnect
- 6 Device Operating Conditions
- 7 Peripheral Information and Electrical Specifications
- 7.1 Parameter Information
- 7.2 Recommended Clock and Control Signal Transition Behavior
- 7.3 Power Supplies
- 7.4 External Clock Input From DEV_MXI/DEV_CLKIN and AUX_MXI/AUX_CLKIN Pins
- 7.5 Clock PLLs
- 7.6 Enhanced Direct Memory Access (EDMA3) Controller
- 7.7 Reset
- 7.8 Interrupts
- 7.9 External Memory Interface (EMIF)
- 7.10 DDR2 Memory Controller
- 7.10.1 DDR2 Memory Controller Electrical Data/Timing
- 7.10.2 DDR2 Interface
- 7.10.2.1 DDR2 Interface Schematic
- 7.10.2.2 Compatible JEDEC DDR2 Devices
- 7.10.2.3 PCB Stackup
- 7.10.2.4 Placement
- 7.10.2.5 DDR2 Keep Out Region
- 7.10.2.6 Bulk Bypass Capacitors
- 7.10.2.7 High-Speed Bypass Capacitors
- 7.10.2.8 Net Classes
- 7.10.2.9 DDR2 Signal Termination
- 7.10.2.10 VREF Routing
- 7.10.2.11 DDR2 CK and ADDR_CTRL Routing
- 7.11 Video Port Interface (VPIF)
- 7.12 Transport Stream Interface (TSIF)
- 7.13 Clock Recovery Generator (CRGEN)
- 7.14 Video Data Conversion Engine (VDCE)
- 7.15 Peripheral Component Interconnect (PCI)
- 7.16 Ethernet MAC (EMAC)
- 7.17 Management Data Input/Output (MDIO)
- 7.18 Host-Port Interface (HPI) Peripheral
- 7.19 USB 2.0 [see Note]
- 7.20 ATA Controller
- 7.21 VLYNQ
- 7.22 Multichannel Audio Serial Port (McASP0/1) Peripherals
- 7.23 Serial Peripheral Interface (SPI)
- 7.24 Universal Asynchronouse Receiver/Transmitter (UART)
- 7.25 Inter-Integrated Circuit (I2C)
- 7.26 Pulse Width Modulator (PWM)
- 7.27 Timers
- 7.28 General-Purpose Input/Output (GPIO)
- 7.29 IEEE 1149.1 JTAG
- 8 Mechanical Packaging and Orderable Information

TMS320DM6467T
www.ti.com
SPRS605C –JULY 2009–REVISED JUNE 2012
For more complete details on the ARM9, refer to the ARM926EJ-S Technical Reference Manual, available
at http://www.arm.com
3.3.2 CP15
The ARM926EJ-S system control coprocessor (CP15) is used to configure and control instruction and
data caches, Tightly-Coupled Memories (TCMs), Memory Management Unit (MMU), and other ARM
subsystem functions. The CP15 registers are programmed using the MRC and MCR ARM instructions,
when the ARM in a privileged mode such as supervisor or system mode.
3.3.3 MMU
The ARM926EJ-S MMU provides virtual memory features required by operating systems such as Linux®,
Windows® CE, Ultron®, ThreadX®, etc. A single set of two level page tables stored in main memory is
used to control the address translation, permission checks and memory region attributes for both data and
instruction accesses. The MMU uses a single unified Translation Lookaside Buffer (TLB) to cache the
information held in the page tables. The MMU features are:
• Standard ARM architecture v4 and v5 MMU mapping sizes, domains and access protection scheme.
• Mapping sizes are:
– 1MB (sections)
– 64KB (large pages)
– 4KB (small pages)
– 1KB (tiny pages)
• Access permissions for large pages and small pages can be specified separately for each quarter of
the page (subpage permissions)
• Hardware page table walks
• Invalidate entire TLB, using CP15 register 8
• Invalidate TLB entry, selected by MVA, using CP15 register 8
• Lockdown of TLB entries, using CP15 register 10
3.3.4 Caches and Write Buffer
The size of the Instruction Cache is 16KB, Data cache is 8KB. Additionally, the Caches have the following
features:
• Virtual index, virtual tag, and addressed using the Modified Virtual Address (MVA)
• Four-way set associative, with a cache line length of eight words per line (32-bytes per line) and with
two dirty bits in the Dcache
• Dcache supports write-through and write-back (or copy back) cache operation, selected by memory
region using the C and B bits in the MMU translation tables.
• Critical-word first cache refilling
• Cache lockdown registers enable control over which cache ways are used for allocation on a line fill,
providing a mechanism for both lockdown, and controlling cache corruption
• Dcache stores the Physical Address TAG (PA TAG) corresponding to each Dcache entry in the TAG
RAM for use during the cache line write-backs, in addition to the Virtual Address TAG stored in the
TAG RAM. This means that the MMU is not involved in Dcache write-back operations, removing the
possibility of TLB misses related to the write-back address.
• Cache maintenance operations provide efficient invalidation of, the entire Dcache or Icache, regions of
the Dcache or Icache, and regions of virtual memory.
The write buffer is used for all writes to a noncachable bufferable region, write-through region and write
misses to a write-back region. A separate buffer is incorporated in the Dcache for holding write-back for
cache line evictions or cleaning of dirty cache lines. The main write buffer has 16-word data buffer and a
four-address buffer. The Dcache write-back has eight data word entries and a single address entry.
Copyright © 2009–2012, Texas Instruments Incorporated Device Overview 11
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