Datasheet

PRODUCTPREVIEW
TMS320C6472
www.ti.com SPRS612G–JUNE 2009– REVISED JULY 2011
2 Device Overview
NOTE
Unless otherwise noted, all address locations in this document are stated in hexidecimal
numbers.
2.1 Device Characteristics
Table 2-1, provides an overview of the C6472 DSP. The table shows significant features of the C6472
device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type
with pin count.
Table 2-1. Characteristics of the C6472 Processor
HARDWARE FEATURES C6472
DDR2 Memory Controller (32-bit bus width) [1.8 V I/O]
1
(clock source = CLKIN3)
EDMA (64 independent channels) 1
High-speed Serial RapidIO Port 2
I2C 1
Peripherals
HPI (16 bit) 1
Not all peripheral pins are
Telecom Serial Interface Port (TSIP) 3
available at the same time
(for more detail, see
UTOPIA (16/8-bit mode, 50-MHz, slave-only) 1
Section 3).
10/100/1000 Mb/s Ethernet MAC (EMAC) 2
Management Data Input/Output (MDIO) 1
12 (6 dedicated [0-5], 1 per core; 6 shared [6-11])
64-bit Timers (Configurable)
1 64-bit or 2 32-bit or WD each
General-Purpose Input/Output Port (GPIO) 16
32K-Byte L1 Program Memory [SRAM/Cache]
Organization per C64x+ Megamodule 32K-Byte L1 Data Memory [SRAM/Cache]
608K-Byte L2 Unified Memory [SRAM/Cache]
On-Chip Memory
768K-byte SL2 Unified SRAM
Shared by all 6 C64x+ Megamodules
768K-byte SL2 ROM
CPU MegaModule Revision ID Register (MM_REVID.[15:0])
0003h
Revision ID Address 0181 2000
JTAG ID register
JTAG ID 0009 102Fh
Address 02A8 0008
Frequency MHz 500/625/700 MHz
Cycle Time ns 2 ns/1.6 ns
1.2 V (DDR2 EMIF)
Core (V)
1.0 V (500 MHz) / 1.1 V (625 MHz) / 1.2 V (700 MHz)
1.2 V [RapidIO],
Voltage
1.5 V/1.8 V [EMAC RGMII],
I/O (V)
1.8 V [DDR2 EMIF I/O], and
1.8 V and 3.3 V [I/O Supply Voltage]
PLL1 and
CLKIN frequency multiplier Bypass (x1), x10-x32
PLL1 Controller Options
PLL2 and CLKIN frequency multiplier
x20
PLL2 Controller Options [EMAC support]
PLL3 and CLKIN frequency multiplier
x20
PLL3 Controller Options [DDR2 Memory Controller support only]
BGA Package 24 x 24 mm 737-Pin Flip-Chip Plastic BGA (CTZ/ZTZ)
Process Technology μm 0.09 μm
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