Datasheet

PRODUCTPREVIEW
TMS320C6472
SPRS612G–JUNE 2009– REVISED JULY 2011 www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
This revision history highlights the technical changes made to the document in this revision.
C6472 Revisions
SEE ADDITIONS/MODIFICATIONS/DELETIONS
Section 1 Features:
Added CTZ package to Features list item
Section 1.1 Changed section title to: CTZ/ZTZ BGA Package (Bottom View)
Changed Figure 1-1 caption to: CTZ/ZTZ 737-Pin Ball Grid Array (BGA) Package (Bottom View)
Section 2.1 Device Characteristics:
Modified Description for BGA Package in Table 2-1, Characteristics of the C6472 Processor
Section 2.8.2.1 Device and Development-Support Tool Nomenclature:
Modified Figure 2-13, TMS320C64x+™ DSP Device Nomenclature (including the TMS320C6472 DSP)
Section 7.5.2 EDMA3 Peripheral Register Descriptions:
Added DMAQNUM4-7 to Table 7-5, EDMA3 Registers
Section 8.1 Thermal Data:
Changed Table 8-1 title to: Thermal Resistance Characteristics (S-PBGA Package) [CTZ/ZTZ]
Section 8.2 Packaging Information:
Added CTZ mechanical package drawing
6 Contents Copyright © 2009–2011, Texas Instruments Incorporated
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