Datasheet

PRODUCTPREVIEW
TMS320C6472
SPRS612G–JUNE 2009– REVISED JULY 2011 www.ti.com
8 Mechanical Data
8.1 Thermal Data
Table 8-1 shows the thermal resistance characteristics for the PBGA - CTZ/ZTZ mechanical package.
Table 8-1. Thermal Resistance Characteristics (S-PBGA Package) [CTZ/ZTZ]
AIR FLOW
NO. °C/W
(lfm)
(1)
1 RΘ
JC
Junction-to-case 0.56 N/A
2 RΘ
JB
Junction-to-board 5.1 N/A
3 12.9 0
4 9.9 150
RΘ
JA
Junction-to-free air
5 8.5 250
6 7.3 500
0.027 0
0.028 150
7 Psi
JT
Junction-to-package top
0.028 250
0.029 500
(1) lfm = linear feet per minute.
8.2 Packaging Information
The following packaging information reflects the most current released data available for the designated
device. This data is subject to change without notice and without revision of this document.
264 Mechanical Data Copyright © 2009–2011, Texas Instruments Incorporated
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