Datasheet

PRODUCTPREVIEW
TMS320C6472
SPRS612G–JUNE 2009– REVISED JULY 2011 www.ti.com
6.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and
Operating Case Temperature (Unless Otherwise Noted)
TEST
PARAMETER MIN TYP MAX UNIT
CONDITIONS
(1)
3.3 V pins (except I2C DV
DD33
= MIN, 0.8 * DV
DD33
V
pins) I
OH
= MAX
I2C pins DV
DD33
= MIN, 0.8 * DV
DD33
V
I
OH
= MAX
V
OH
High-level ouput voltage
RGMII pins DV
DD15
- 0.4 V
DDR2 memory DV
DD18
- 0.4 V
controller pins
3.3-V pins (except I2C DV
DD33
= MIN, 0.4 V
pins) I
OL
= MAX
I2C pins Pulled up to 3.3 V, 0.4 V
3 mA sink current
V
OL
Low-level ouput voltage
RGMII pins 0.4 V
DDR2 memory 0.4 V
controller pins
V
I
= V
SS
to
DV
DD33
, pins
without internal -1 1 uA
pull-up or
pull-down resistor
V
I
= V
SS
to
3.3-V pins (except I2C
DV
DD33
, pins with
pins) 50 100 400 uA
internal pull-up
resistor
I
I
Input current (DC)
V
I
= V
SS
to
DV
DD33
, pins with
-400 -100 -50 uA
internal pull-down
resistor
0.1 * DV
DD33
≤ V
I
≤
I2C pins -10 10 uA
0.9 * DV
DD33
RGMII pins -1 1 uA
DDR2 memory
-1 1 uA
controller pins
E Class Buffers -
EMU[18:0] and all
3.3-V Ethernet, except
-7 mA
MCRS0_RMCRSDV0,
MCOL0, GMDIO, and
GMDCLK
D Class Buffers -
GPIO[15:0], TDO,
-3 mA
HOUT, and
SYSCLKOUT
I
OH
High-level output current
C Class Buffers - HPI,
TSIP, UTOPIA,
BOOTACTIVE,
WDOUT,
-3 mA
RESETSTAT, TIMO2,
MCRS0_RMCRSDV0,
MCOL0, GMDIO, and
GMDCLK
RGMII pins -8 mA
DDR pins -13.4 mA
(1) For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table.
116 Device Operating Conditions Copyright © 2009–2011, Texas Instruments Incorporated
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