Datasheet

Mechanical Specifications
2-4
Figure 2−3. XDS560 Target Header Dimensions
0.195
0.282
0.484
0.720
0.895in.
0.764
0.764
0.895
Top View
Side View
Bottom View
Front View
0.100
0.100
0.07
2.1.2 Environmental Specifications
The emulator card has been design to operate within normal PC environmen-
tal conditions, i.e., 0°C−55°C. Elevated temperatures, beyond the range spe-
cified may provide unknown performance results.
The emulator card is designed to operate within a relative humidity of
20%−70%, Non-condensing. Operation of any electronic products outside of
this range could permanently damage your equipment. Care should be taken
regarding moisture condensation and static discharge (ESD).
The emulator pod assembly has been designed to operate within normal de-
bug ambient environmental conditions, i.e., 0°C−55°C.
Lower temperatures may have an impact on it’s structural and mechanical in-
tegrity. Elevated ambient temperatures, beyond 70°C may produce unknown
performance results.
Elevated temperature applications that come in direct contact with the pod
cable assembly should used additional means to maintain an interface tem-
perature less than 60°C on the cable assembly.