XDS560 Emulator Technical Reference SPRU589A April 2002 Revised October 2007 Printed on Recycled Paper
Preface Read This First About This Manual This technical reference describes the fundamentals of XDS560 PCI Emulator and Pod and how to interface it to a target system. How to Use This Manual This document contains the following chapters: - Chapter one contains a brief overview of the features available with the XDS560 PCI Emulator and Pod.
Notational Conventions - In syntax descriptions, the instruction, command, or directive is in a bold typeface font and parameters are in an italic typeface. Portions of a syntax that are in bold should be entered as shown; portions of a syntax that are in italics describe the type of information that should be entered. Here is an example of a directive syntax: .asect ”section name”, address .asect is the directive. This directive has two parameters, indicated by section name and address. When you use .
Information About Cautions and Warnings Information About Cautions and Warnings This book may contain cautions and warnings. This is an example of a caution statement. A caution statement describes a situation that could potentially damage your software or equipment. This is an example of a warning statement. A warning statement describes a situation that could potentially cause harm to you. The information in a caution or a warning is provided for your protection.
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Contents Contents 1 XDS560 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 A brief overview of the features available in the XDS560 1.1 2 Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 Mechanical Specifications and Installation instructions for the XDS560 Emulator 2.1 2.2 3 XDS560 Features . . . . . . .
Figures Figures 2−1 2−2 2−3 3−1 3−2 3−3 3−4 3−5 3−6 3−7 3−8 vi XDS560 PCI Emulator Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 XDS560 Cable and Pod Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 XDS560 Target Header Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 14-Pin Target Header Pin Dimensions . . . . . . . . . . . . . . . .
Tables Tables 2−1 3−1 3−2 3−3 3−4 3−5 Emulator Cable Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Standard TAP Controller JTAG Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . XDS560 Connection Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TI Advance Emulation Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Equations Equations 3−1 3−2 3−3 viii Key Timing Path Case 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10 Key Timing Path Case 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11 Calculating EMU0-EMU1 Lines That Don’t Support HS-RTDX . . . . . . . . . . . . . . . . . . . . .
Notes, Cautions, and Warnings Notes, Cautions, and Warnings Minimizing Personal Injury . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6 Minimizing Electrical Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6 Minimizing Static Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Chapter 1 XDS560 Overview This chapter is a brief overview of the features available in the XDS560 PCI Emulator and Pod. Topic 1.1 Page XDS560 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
XDS560 Features 1.1 XDS560 Features This technical reference describes the fundamentals of XDS560 PCI Emulator and Pod and how to interface it to a target system. The XDS560 emulator target interface and connector are designed to be backwards compatible with the XDS510 emulator using either the 3/5V or 1.8/5V pod. Features of the XDS560: - PCI-bus based emulator board - Support for HS-RTDX enabled devices - Wide dynamic operating voltage: 0.5 to 5.
Chapter 2 Hardware This chapter contains mechanical specifications and installation instructions for the XDS560 Emulator Pod. Topic Page 2.1 Mechanical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 2.2 XDS560 Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Mechanical Specifications 2.1 Mechanical Specifications The Texas Instruments XDS560 emulator consists of a PCI-based emulator board and a complementary interconnecting target cable assembly. The PCI-based emulator board is designed to operate as an universal card in either a 5.0-V, 3.3-V or universal 32-bit PCI expansion slot. The PCI interface is complaint with revision 2.2 of the PCI bus specification. The emulator board uses only the +5 V and requires a maximum current of 2.
Mechanical Specifications Note that the pin-to-pin spacing on the connector is 0.100 inches in both the X and Y planes, (identical to existing TI 14pin JTAG products). The cable pod and the end connector cases are made of nonconductive medium-impact resistant plastic. Figure 2−2. XDS560 Cable and Pod Dimensions 59 in 0.48 in 7 in 2.
Mechanical Specifications Figure 2−3. XDS560 Target Header Dimensions Top View 0.764 Bottom View 0.100 0.895 0.100 0.895in. 0.764 0.484 0.282 0.07 0.720 0.195 Front View Side View 2.1.2 Environmental Specifications The emulator card has been design to operate within normal PC environmental conditions, i.e., 0°C−55°C. Elevated temperatures, beyond the range specified may provide unknown performance results.
Mechanical Specifications The emulator pod cable assembly is designed to operate within a relative humidity of 20%−70%, Non Condensing. Operation of any electronic products outside of this range could permanently damage your equipment. Care should be taken regarding moisture condensation and static discharge (ESD). 2.1.3 Physical Specifications The emulator pod cable assembly has been designed to withstand normal flex, Angle, Twist, Force, Strain, and Jerk operations.
XDS560 Installation 2.2 XDS560 Installation Minimizing Personal Injury Minimizing Personal Injury: To minimize the risk of personal injury, always turn off the power to your PC and unplug the power cord before installing the XDS560.
Chapter 3 Target Design Considerations for Using the XDS560 Emulation Pod The following sections will discuss the design issues of designing a target system to support using the XDS560 emulator. Topic Page 3.1 Emulation Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 3.2 Target System’s Emulator Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 3.3 For More Information About the IEEE 1149.1 Standard . . . . . . . . . . .
Emulation Signals 3.1 Emulation Signals There are five standard signals and a ground used for JTAG connections to control the JTAG† Test Access Port (TAP) Controller, as defined by the IEEE 1149.1 standard. These signals are shown in Table 3−1.
Emulation Signals Additionally, Texas Instruments adds two more signals, used for advanced emulation capability, to the JTAG header. These signals, shown in Table 3−3, provide the capability to perform HighSpeed Real-Time Data eXchange (RTDX), benchmarking, software profiling and multi-processor emulation with inter-processor breakpoint capabilities. Table 3−3.
Target System’s Emulator Connector 3.2 Target System’s Emulator Connector JTAG target devices support emulation through a dedicated emulation port. This port is a superset of the IEEE 1149.1 standard and is accessed by the emulator. To communicate with the emulator, your target system must have a 14-pin header (two rows of seven pins) and configured as shown in Figure 3−1. If this pinout for this header is changed, it may have an affect on operation and signal integrity. Figure 3−1.
For More Information About the IEEE 1149.1 Standard 3.3 For More Information About the IEEE 1149.
Bus Protocol 3.4 Bus Protocol The IEEE 1149.1 standard covers the requirements for the test access port (TAP) bus slave devices and provides certain rules, summarized as follows: - The TMS/TDI inputs are sampled on the rising edge of the TCK signal of the slave device. - The TDO output is clocked from the falling edge of the TCK signal of the slave device.
XDS560 Emulator Cable Pod Logic 3.5 XDS560 Emulator Cable Pod Logic Figure 3−2 shows a portion of the XDS560 emulator cable pod. The following items are characteristics of the XDS560 pod: - Signals TMS, TDI and TRST are series terminated to reduce signal reflec- tions. - The TCK signal output has a medium-current drive capability of 24 mA IOL/IOH. The TCK signal is AC termination on the return side of the TCK (TCK_RET). The termination voltage is set to ½ of the TVD voltage to minimize loading effects.
XDS560 Emulator Cable Pod Logic To support selection of the proper I/O voltage, the target header has a Target Voltage Detect (TVD) signal. This signal (pin 5) should be tied to the I/O voltage of the target processor. If the target system needs to supports multiple I/O voltages on the scan string, the lowest voltage devices should be placed first. A translation buffer should be used to connect the rest of the scan string. TCK, TMS, and TRST must have similar considerations.
XDS560 Emulator Cable Pod Signal Timing 3.6 XDS560 Emulator Cable Pod Signal Timing Figure 3−3 shows the default timing waveforms for the XDS560 emulator cable pod. Table 3−5 defines the timing parameters. These timing parameters are calculated from values specified in the standard data sheets for the emulator and cable pod and are for reference only. The presented timing parameters are calculated for the end of the 14-pin target cable header. Texas Instruments does not test or guarantee these timings.
XDS560 Emulator Cable Pod Signal Timing 3.6.1 Emulation Timing Calculations The following examples help you calculate emulation timings in your system. For actual target timing parameters, see the appropriate device data sheet.
XDS560 Emulator Cable Pod Signal Timing ƪt d(TTDO) ) t su(TDOmin)ƫ t pdĂǒTCK_RET*TDO ǓĂ +Ă t ǒTCKfactor Ǔ +Ă [15Ăns ) 2.5Ăns] 0.4 +Ă 43.75ĂnsĂ(22.9ĂMHz) In this case, the TCK_RET-to-TDO path is the limiting factor. Equation 3−2. Key Timing Path Case 2 Case 2: Single/multiprocessor, TMS/TDI/TCK buffered input, TDO buffered output, TMS/TDI timed from TCK_RET high. t pdĂǒTCK_RET*TMSńTDI ǓĂ +Ă t d(TMSmax) ) t su(TTMS) ) t ǒbufskew Ǔ +Ă [31Ăns ) 10Ăns ) 1.35Ăns] +Ă 42.35ĂnsĂ(23.
Connections Between the Emulator and the Target System 3.7 Connections Between the Emulator and the Target System It is extremely important to provide high-quality signals between the emulator and the JTAG target system. Depending upon the situation, you must supply the correct signal buffering, test clock inputs, and multiple processor interconnections to ensure proper emulator and target system operation.
Connections Between the Emulator and the Target System Importance of Good Design Practices The target board designer should use good design practices to minimize signal crosstalk and signal skew. The designer must also take into account any propagation delays of these signals and the effect that they will have on the timing of the emulation. Figure 3−5.
Connections Between the Emulator and the Target System 3.7.2 Using a Target-System Clock Figure 3−6 shows an application with the system test clock generated in the target system. In this application, the TCK signal is left unconnected. Figure 3−6.
Connections Between the Emulator and the Target System - Buffering EMU0 and EMU1 is optional but highly recommended to provide isolation. These are not critical signals and do not have to be buffered through the same physical package a TMS, TCK, TDI, and TDO. Unbuffered and buffered signals are shown in this section Figure 3−7.
EMU0−EMU1 Signal Considerations 3.8 EMU0−EMU1 Signal Considerations The EMU0−EMU1 signals are bi-directional multifunctional signals. These signals are used for software benchmarking and software profiling. On multi-processor systems, they can be used to assist in debugging by causing an interrupt or breakpoint to occur from one device to another. These signals are used for HS-RTDX (High-Speed Real Time Data eXchange). HS-RTDX is a form of bi-directional data transfer.
EMU0−EMU1 Signal Considerations The CBT device could be used to limit the number of devices that the driving EMU0−EMU1 signal is loaded with; thereby limiting the amount of capacitance loading that is seen by the driving EMU0−EMU1 signal. Using this solution would require the user to have a manual jumper selection to enable which bank of devices that emulator would able to establish HSRTDX communication with.
EMU0−EMU1 Signal Considerations 3-18
Index Emulator, in connection with the target system 3-12 B Emulator Connector, for the Target System Buffering Signals 3-12 Bus Protocol, IEEE 1149.
P PCI, information for 2.
Index-3
Index-4
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