Datasheet

F28M36P63C, F28M36P53C, F28M36H53C, F28M36H53B, F28M36H33C, F28M36H33B
www.ti.com SPRS825C –OCTOBER 2012–REVISED FEBRUARY 2014
9 Mechanical Packaging and Orderable Information
9.1 Thermal Data for ZWT Package
Table 9-1 and Table 9-2 show the thermal data. See Section 6.2 for more information on thermal design
considerations.
Table 9-1. Thermal Model 289-Ball ZWT Results (Revision 0 Silicon)
AIR FLOW
PARAMETER 0 lfm 150 lfm 250 lfm 500 lfm
θ
JA
[°C/W] High k PCB 23.0 20.5 19.5 18.5
Ψ
JT
[°C/W] 0.5 0.6 0.8 1.0
Ψ
JB
12.9 12.9 12.8 12.7
θ
JC
10.5
θ
JB
12.8
Table 9-2. Thermal Model 289-Ball ZWT Results (Revision A Silicon)
AIR FLOW
PARAMETER 0 lfm 150 lfm 250 lfm 500 lfm
θ
JA
[°C/W] High k PCB 20.6 17.9 16.8 15.6
Ψ
JT
[°C/W] 0.25 0.35 0.42 0.53
Ψ
JB
10.4 10.5 10.4 10.3
θ
JC
7.5
θ
JB
10.5
9.2 Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2012–2014, Texas Instruments Incorporated Mechanical Packaging and Orderable Information 249
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