Datasheet
F28M36P63C, F28M36P53C, F28M36H53C, F28M36H53B, F28M36H33C, F28M36H33B
SPRS825C –OCTOBER 2012–REVISED FEBRUARY 2014
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Table 6-20. Master Subsystem – Flash Parameters at 125 MHz
(1)(2)
TEST
PARAMETER MIN TYP MAX UNIT
CONDITIONS
Program Time
(3)
128 bits 240 μs
32K Sector 500 ms
128K Sector 2000 ms
Erase Time 32K Sector 50 ms
128K Sector 50 ms
(1) The on-chip flash memory is in an erased state when the device is shipped from TI. As such, erasing the flash memory is not required
prior to programming, when programming the device for the first time. However, the erase operation is needed on all subsequent
programming operations.
(2) Erase time includes Erase verify by the CPU.
(3) Program time includes overhead of state machine but does not include data transfer time. Program time assumes programming 144 bits
at a time. Program time includes Program verify by the CPU.
Table 6-21. Master Subsystem – Flash/OTP Access Timing
(1)
PARAMETER MIN MAX UNIT
t
a(f)
Flash access time 25 ns
t
a(OTP)
OTP access time 50 ns
(1) Access time numbers shown in this table are prior to device characterization. Final numbers will be published in the datasheet for the
fully qualified production device.
Table 6-22. Master Subsystem – Flash Data Retention Duration
PARAMETER TEST CONDITIONS MIN MAX UNIT
t
retention
Data retention duration T
J
= 85°C 20 years
140 Electrical Specifications Copyright © 2012–2014, Texas Instruments Incorporated
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