Datasheet

F28M36P63C, F28M36P53C, F28M36H53C, F28M36H53B, F28M36H33C, F28M36H33B
SPRS825C –OCTOBER 2012–REVISED FEBRUARY 2014 www.ti.com
6.2 Thermal Design Considerations
Based on the end-application design and operational profile, the I
DD12
, I
DD18
, and I
DDIO
currents could vary.
Systems that exceed the recommended maximum power dissipation in the end product may require
additional thermal enhancements. Ambient temperature (T
A
) varies with the end application and product
design. The critical factor that affects reliability and functionality is T
J
, the junction temperature, not the
ambient temperature. Hence, care should be taken to keep T
J
within the specified limits. T
case
should be
measured to estimate the operating junction temperature T
J
. T
case
is normally measured at the center of
the package top-side surface. For more details about thermal metrics and definitions, see the
Semiconductor and IC Package Thermal Metrics Application Report (literature number SPRA953) and the
Reliability Data for TMS320LF24xx and TMS320F28xx Devices Application Report (literature number
SPRA963).
130 Electrical Specifications Copyright © 2012–2014, Texas Instruments Incorporated
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