Datasheet

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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
THERMAL CHARACTERISTICS
RECOMMENDED OPERATING CONDITIONS
TMDS442
SLLS757A – AUGUST 2006 – REVISED MARCH 2007
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
V
CC
Supply voltage range
(2)
– 0.5 V to 4 V
Aim*, Bim 2.5 V to 4 V
Voltage range Yjm, Zjm, , Vsadjj, HPDi, 5V_SINKj, LC_SCL, LC_SDA, LC_A0, LC_A1, GE, GPIO – 0.5V to 4 V
SCLi, SCL_SINKj, SDAi, SDA_SINKj, HPD_SINKj, 5V_PWRi – 0.5 V to 6 V
Aim, Bim ± 6 kV
Human body model
(3)
All pins ± 5 kV
Electrostatic discharge
Charged-device model
(4)
(all pins) ± 1500 V
Machine model
(5)
(all pins) ± 200 V
See Dissipation
Continuous power dissipation
Rating Table
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
(3) Tested in accordance with JEDEC Standard 22, Test Method A114-B
(4) Tested in accordance with JEDEC Standard 22, Test Method C101-A
(5) Tested in accordance with JEDEC Standard 22, Test Method A115-A
DERATING FACTOR
(1)
T
A
= 70 ° C
PACKAGE PCB JEDEC STANDARD T
A
≤ 25 ° C
ABOVE T
A
= 25 ° C POWER RATING
128-TQFP PNP Low-K
(2)
2129.47 mW 21.2947 mW/ ° C 1171.20 mW
128-TQFP PNP High-K
(3)
4308.48 mW 43.0848 mW/ ° C 2369.66 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
(2) In accordance with the Low-K thermal metric definitions of EIA/JESD51-3
(3) In accordance with the High-K thermal metric definitions of EIA/JESD51-7
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
R
θ JB
Junction-to-board thermal resistance 7.86 ° C/W
R
θ JC
Junction- to-case thermal resistance 19.5 ° C/W
V
IH
= V
CC
, V
IL
= V
CC
- 0.6 V, R
T
= 50 Ω , AV
CC
= 3.3 V,
V
CC
= 3.6 V, R
VSADJ
= 4.6 k Ω , PRE = Low or high
P
D
Device power dissipation 1431 mW
Ai/Bi(2:4)= 1.65 Gbps HDMI data pattern,
Ai/Bi(1) = 165 MHz clock
MIN NOM MAX UNIT
V
CC
Supply voltage 3 3.3 3.6 V
T
A
Operating free-air temperature 0 70 ° C
TMDS DIFFERENTIAL PINS (A/B)
V
IC
Input common mode voltage V
CC
– 400 V
CC
+10 mV
V
ID
Receiver peak-to-peak differential input voltage 150 1560 mVp-p
R
VSADJ
Resistor for TMDS compliant voltage swing range 4.6 4.64 4.68 k Ω
AV
CC
TMDS Output termination voltage, see Figure 3 3 3.3 3.6 V
R
T
Termination resistance, see Figure 3 45 50 55 Ω
Signaling rate 0 2.25 Gbps
CONTROL PINS (LC_A0, LC_A1, GE, GPIO)
V
IH
LVTTL High-level input voltage 2 V
CC
V
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