Datasheet

TMDS351
www.ti.com SLLS840B –MAY 2007– REVISED JULY 2011
ORDERING INFORMATION
(1)
PART NUMBER PART MARKING PACKAGE
TMDS351PAG TMDS351 64-PIN TQFP
TMDS351PAGR TMDS351 64-PIN TQFP Tape/Reel
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
Supply voltage V
CC
–0.5 V to 4 V
range
(2)
V
DD
–0.5 V to 6 V
Anm
(3)
, Bnm 2.5 V to 4 V
Voltage range Ym, Zm, VSADJ, EQ –0.5V to 4 V
SCLn, SCL_SINK, SDAn, SDA_SINK, HPDn, HPD_SINK, S1, S2 –0.5 V to 6 V
Anm, Bnm ±8000 V
Human body model
(4)
All pins ±4000 V
Electrostatic
discharge
Charged-device model
(5)
(all pins) ±1500 V
Machine model
(6)
(all pins) ±200 V
See Dissipation Rating
Continuous power dissipation
Table
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
(3) n = 1, 2, 3; m = 1, 2, 3, 4
(4) Tested in accordance with JEDEC Standard 22, Test Method A114-B
(5) Tested in accordance with JEDEC Standard 22, Test Method C101-A
(6) Tested in accordance with JEDEC Standard 22, Test Method A115-A
DISSIPATION RATINGS
PCB JEDEC DERATING FACTOR
(1)
T
A
= 70°C
PACKAGE T
A
≤ 25°C
STANDARD ABOVE T
A
= 25°C POWER RATING
Low-K 1111 mW 11.19 mW/°C 611 mW
64-TQFP PAG
High-K 1492 mW 14.92 820 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX
(1)
UNIT
R
θJB
Junction-to-board thermal
33.4 °C/W
resistance
R
θJC
Junction- to-case thermal
15.6 °C/W
resistance
V
IH
= V
CC
, V
IL
= V
CC
- 0.6 V, R
T
= 50 Ω, AV
CC
= 3.3 V,
P
D
Device power dissipation Am/Bm(2:4) = 2.5-Gbps HDMI data pattern, 590 750 mW
Am/Bm(1) = 250-MHz clock
T
J
Junction Temperature 0 125 °C
(1) The maximum rating is simulation under 3.6-V V
CC
, 5.5-V V
DD
, and 600 mV V
ID
.
Copyright © 2007–2011, Texas Instruments Incorporated 7