Datasheet

TLV803M, TLV803R
TLV803S, TLV803Z
TLV863M
SBVS157B –APRIL 2011– REVISED AUGUST 2011 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
(1)
SPECIFIED
THRESHOLD PACKAGE- PACKAGE OPERATING PACKAGE ORDERING TRANSPORT MEDIA,
PRODUCT VOLTAGE LEAD DESIGNATOR TEMPERATURE MARKING INFORMATION QUANTITY
TLV803ZDBZR Tape and Reel, 3000
TLV803Z 2.25 V SOT23-3 DBZ –40°C TO +125°C VORQ
TLV803ZDBZT Tape and Reel, 250
TLV803RDBZR Tape and Reel, 3000
TLV803R 2.64 V SOT23-3 DBZ –40°C TO +125°C VOSQ
TLV803RDBZT Tape and Reel, 250
TLV803SDBZR Tape and Reel, 3000
TLV803S 2.93 V SOT23-3 DBZ –40°C TO +125°C VOTQ
TLV803SDBZT Tape and Reel, 250
TLV803MDBZR Tape and Reel, 3000
TLV803M 4.38 V SOT23-3 DBZ –40°C TO +125°C VOUQ
TLV803MDBZT Tape and Reel, 250
TLV863MDBZR Tape and Reel, 3000
TLV863M 4.38 V SOT23-3 DBZ –40°C TO +125°C VTWM
TLV863MDBZT Tape and Reel, 250
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted) .
VALUE
MIN MAX UNIT
V
DD
(2)
0 7 V
Voltage
All other pins
(2)
–0.3 7 V
Maximum low output current, I
OL
5 mA
Maximum high output current, I
OH
–5 mA
Current
Input clamp current, I
IK
(V
I
< 0 or V
I
> V
DD
) ±20 mA
Output clamp current, I
OK
(V
O
< 0 or V
O
> V
DD
) ±20 mA
Operating free-air temperature range, T
A
–40 +125 °C
Temperature Storage temperature range, T
stg
–65 +150 °C
Soldering temperature +260 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND. For reliable operation the device should not be operated at 7 V for more than t = 1000h
continuously
THERMAL INFORMATION
TLV803/TLV863
THERMAL METRIC
(1)
DBZ UNITS
3 PINS
θ
JA
Junction-to-ambient thermal resistance 286.9
θ
JCtop
Junction-to-case (top) thermal resistance 105.6
θ
JB
Junction-to-board thermal resistance 124.4
°C/W
ψ
JT
Junction-to-top characterization parameter 25.8
ψ
JB
Junction-to-board characterization parameter 107.9
θ
JCbot
Junction-to-case (bottom) thermal resistance —
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2 Copyright © 2011, Texas Instruments Incorporated