Datasheet

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Table 1. Thermal Resistance, θ
JA
, and Maximum Power Dissipation
Max Vin at 150 mA Max Vin at 150 mA
IC Board Package θ
JA
(T
A
= 25°C) (T
A
= 70°C)
TLV71312 High-K DQN 393.3°C/W 2.89 V 2.13 V
TLV71318 High-K DQN 393.3°C/W 3.50 V 2.73 V
TLV71333 High-K DQN 393.3°C/W 5.0 V 4.23 V
6 Board layout
Figure 6. Assembly Layer
Figure 7. Top Layer Routing
5
SLVU771–September 2012 TLV713xxPEVM-171 Evaluation Module
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