Datasheet

0
20
40
60
80
100
120
10 100 1K 10K 100K 1M 10M
PSRR (dB)
Frequency (Hz)
V = 3 V
IN
V = 4 V
IN
V = 5 V
IN
0
10
20
30
40
50
60
70
80
90
100
10 100 1K 10K 100K 1M 10M
PSRR (dB)
Frequency (Hz)
I = 10 mA
OUT
I = 50 mA
OUT
I = 100 mA
OUT
I = 150 mA
OUT
Thermal Guidelines and Layout Recommendations www.ti.com
Figure 4. PSRR of the TLV71318PEVM-171 for Various Output Currents, V
IN
= 3 V
Figure 5. PSRR of the TLV71318PEVM-171 for Various Input Voltages, I
OUT
= 150 mA
5 Thermal Guidelines and Layout Recommendations
Thermal management is a key component of the design of any power converter and is especially
important when the power dissipation in the LDO is high. Use the following formula to approximate the
maximum power dissipation for the particular ambient temperature:
T
J
= T
A
+ P
D
× θ
JA
Where T
J
is the junction temperature, T
A
is the ambient temperature, P
D
is the power dissipation in the
device (Watts), and θ
JA
is the thermal resistance from junction to ambient. All temperatures are in degrees
Celsius. The maximum operating junction temperature, T
J
, must not be allowed to exceed 125°C. The
layout design must be copper trace and plane areas smartly, as thermal sinks, in order not to allow T
J
to
exceed the absolute maximum rating under all temperature conditions and voltage conditions across the
part.
Table 1 repeats information from the Dissipation Ratings Table of the TLV713xxP series data sheet for
comparison with the thermal resistance, θ
JA
, for High-K JEDEC standard boards. The maximum input
voltage can be calculated for full loads at different ambient temperatures. The input voltage must be less
than these values in order to maintain a safe junction temperature.
4
TLV713xxPEVM-171 Evaluation Module SLVU771–September 2012
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