Datasheet

See Note (1)
www.ti.com Bill of Materials
6.2 Schematic
Figure 6 illustrates the schematic for this EVM.
(1) Refer to Table 2 for component values.
Figure 6. TLV705xxxEVM-596 Schematic
7 Bill of Materials
Table 2 lists the bill of materials for the TLV705xxxEVM-596.
Table 2. TLV705xxxEVM-596 Bill of Materials
(1)(2)(3)(4)(5)
EVM Device Option: Count
-001 -002 -003 -004 -005 -006 RefDes Value Description Size Part Number, MFR
Capacitor, Ceramic, Low
2 2 2 2 2 2 C1, C2 1.0 µF 0603 STD
Inductance, 6.3V, X7R, 10%
Header, 2-pin, 100-mil
4 4 4 4 4 4 J1, J2, J3, J4 PEC02SAAN 0.100 inch x 2 PEC02SAAN, Sullins
spacing
Header, 3-pin, 100-mil
1 1 1 1 1 1 JP1 PEC03SAAN 0.100 inch x 3 PEC03SAAN, Sullins
spacing
IC, 200mA, Low IQ, LDO
1 0 0 0 0 0 U1 TLV70518YFF WCSP TLV70518YFF, TI
Regulator
IC, 200mA, Low IQ, LDO
0 1 0 0 0 0 U1 TLV70518PYFF WCSP TLV70518PYFF, TI
Regulator
IC, 200mA, Low IQ, LDO
0 0 1 0 0 0 U1 TLV70528YFF WCSP TLV70528YFF, TI
Regulator
IC, 200mA, Low IQ, LDO
0 0 0 1 0 0 U1 TLV70528PYFF WCSP TLV70528PYFF, TI
Regulator
IC, 200mA, Low IQ, LDO
0 0 0 0 1 0 U1 TLV70533YFF WCSP TLV70533YFF, TI
Regulator
IC, 200mA, Low IQ, LDO
0 0 0 0 0 1 U1 TLV70533PYFF WCSP TLV70533PYFF, TI
Regulator
1 1 1 1 1 1 — Shunt Shunt, 100-mil, Black 0.100 929950-00, 3M
PCB, 1.090 In x1.610 In x
1 1 1 1 1 1 — HPA596 -- HPA596, Any
0.062 In
1.25 x 0.25
1 1 1 1 1 1 — — Label THT-13-457-10, Brady
inch
(1)
These assemblies are ESD sensitive; ESD precautions must be observed.
(2)
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
(3)
These assemblies must comply with IPC-A-610 Class 2 workmanship standards.
(4)
All components may be substituted with equivalent manufacturer's components.
(5)
Install label after final wash. Text must be 8-point font. Mark in accordance with assembly numbers shown in Table 3.
7
SLVU439– August 2011 TLV705xxxEVM-596 Evaluation Module
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