Datasheet

ExampleBoardLayout
StencilOpenings
BasedonStencilThickness
of0,127mm(.005in)
TLV702xx
SLVSAG6B –SEPTEMBER 2010– REVISED FEBRUARY 2011 www.ti.com
(1) All linear dimensions are in millimeters.
(2) Customers should place a note on the circuit board fabrication drawing not to alter the center solder mask defined
pad.
(3) Publication IPC-7351 is recommended for alternate designs.
(4) Laser-cutting apertures with trapedzoidal walls and also rounding corners will offer better paste release. Customers
should contact their board assembly site for stencil design recommendations. Example stencil design based on a 50%
volumetric load solder paste. Refer to IPC-7525 for other stencil recommendations.
Figure 29. Recommended Land Pattern for DBV Package
14 Submit Documentation Feedback © 2010–2011, Texas Instruments Incorporated