Datasheet

PRODUCTPREVIEW
TLV701xx
SBVS161 –NOVEMBER 2011 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS
(1)
PRODUCT V
OUT
TLV701xxyyyz XX is nominal output voltage (for example, 30 = 3.0 V)
YYY is Package Designator
Z is Package Quantity
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE UNIT
MIN MAX
Voltage
(2)
IN –0.3 24 V
Current source OUT Internally limited
Operating junction, T
J
–40 +150 °C
Temperature
Storage, T
stg
–65 +150 °C
Human body model (HBM)
2 kV
QSS 009-105 (JESD22-A114A)
Electrostatic Discharge Rating
(3)
Charged device model (CDM)
500 V
QSS 009-147 (JESD22-C101B.01)
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to network ground terminal.
(3) ESD testing is performed according to the respective JESD22 JEDEC standard.
THERMAL INFORMATION
TLV701XX
THERMAL METRIC
(1)
DBV UNITS
5 PINS
θ
JA
Junction-to-ambient thermal resistance 213.1
θ
JCtop
Junction-to-case (top) thermal resistance 110.9
θ
JB
Junction-to-board thermal resistance 97.4
°C/W
ψ
JT
Junction-to-top characterization parameter 22.0
ψ
JB
Junction-to-board characterization parameter 78.4
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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