Datasheet

TLV70012A-Q1, TLV70025-Q1, TLV70028-Q1
TLV70030-Q1, TLV70032-Q1, TLV70033-Q1
SLVSA61F FEBRUARY 2010REVISED AUGUST 2013
www.ti.com
As with any linear regulator, PSRR and transient response are degraded as (V
IN
V
OUT
) approaches dropout.
This effect is shown in Figure 13 in the Typical Characteristics section.
Transient Response
As with any regulator, increasing the size of the output capacitor reduces over-/undershoot magnitude but
increases the duration of the transient response.
Undervoltage Lockout (UVLO)
The TLV700xx-Q1 uses an undervoltage lockout circuit to keep the output shut off until internal circuitry is
operating properly.
Thermal Information
Thermal protection disables the output when the junction temperature rises to approximately 160°C, allowing the
device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is again
enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection
circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a
result of overheating.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate
heatsink. For reliable operation, junction temperature should be limited to 125° C maximum. To estimate the
margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal
protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should
trigger at least 35°C above the maximum expected ambient condition of the particular application. This
configuration produces a worst-case junction temperature of 125°C at the highest expected ambient temperature
and worst-case load.
The internal protection circuitry of the TLV700xx-Q1 has been designed to protect against overload conditions. It
was not intended to replace proper heatsinking. Continuously running the TLV700xx-Q1 into thermal shutdown
degrades device reliability.
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