Datasheet

ExampleBoardLayout
StencilOpenings
BasedonStencilThickness
of0,127mm(.005in)
TLV700xx
www.ti.com SLVSA00D –SEPTEMBER 2009–REVISED NOVEMBER 2012
(1) All linear dimensions are in millimeters.
(2) Customers should place a note on the circuit board fabrication drawing not to alter the center solder mask defined
pad.
(3) Publication IPC-7351 is recommended for alternate designs.
(4) Laser-cutting apertures with trapedzoidal walls and also rounding corners will offer better paste release. Customers
should contact their board assembly site for stencil design recommendations. Example stencil design based on a 50%
volumetric load solder paste. Refer to IPC-7525 for other stencil recommendations.
Figure 23. Recommended Land Pattern for DDC Package
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