Datasheet

COUT
VOUT
CIN
L1VIN
FB
PG
TLV62130
R1
R2
CSS
R3
PVIN
AVIN
EN
SS/TR
DEF
FSW
SW
VOS
PG
FB
AGND
PGND
TLV62130, TLV62130A
SLVSB74B FEBRUARY 2012REVISED JUNE 2013
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PARAMETER MEASUREMENT INFORMATION
List of Components
REFERENCE DESCRIPTION MANUFACTURER
IC 17V, 3A Step-Down Converter, QFN TLV62130RGT, Texas Instruments
L1 2.2µH, 0.165 x 0.165 in XFL4020-222MEB, Coilcraft
Cin 10µF, 25V, Ceramic Standard
Cout 22µF, 6.3V, Ceramic Standard
Cs 3300pF, 25V, Ceramic
R1 depending on Vout
R2 depending on Vout
R3 100kΩ, Chip, 0603, 1/16W, 1% Standard
spacing
Figure 3. Measurement Setup
TYPICAL CHARACTERISTICS
Table of Graphs
DESCRIPTION FIGURE
Efficiency vs Output Current, vs Input Voltage 4 - 15
vs Output current (Load regulation), vs Input Voltage
Output voltage 16, 17
(Line regulation)
vs Input Voltage 18
Switching Frequency
vs Output Current 19
Quiescent Current vs Input Voltage 20
Shutdown Current vs Input Voltage 21
Power FET RDS(on) vs Input Voltage (High-Side, Low-Side) 22, 23
Output Voltage Ripple vs output Current 24
Maximum Output Current vs Input Voltage 25
Power Supply Rejection Ratio (PSSR) vs Frequency 26, 27
PWM-PSM-PWM Mode Transition 28
Load Transient Response 29 - 31
Waveforms Startup 32, 33
Typical PWM Mode Operation 34
Typical Power Save Mode Operation 35
vs Load Current 36
Maximum Ambient Temperature
vs Power Dissipation 37
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