Datasheet

TLV62130, TLV62130A
SLVSB74B –FEBRUARY 2012–REVISED JUNE 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
(1)
T
A
OUTPUT VOLTAGE PART NUMBER
(2)
PACKAGE ORDERING PACKAGE
MARKING
adjustable TLV62130 16-Pin QFN TLV62130RGT VUBI
-40°C to 85°C
adjustable TLV62130A
(3)
16-Pin QFN TLV62130ARGT VUNI
(1) For detailed ordering information please check the PACKAGE OPTION ADDENDUM section at the end of this datasheet.
(2) Contact the factory to check availability of other fixed output voltage versions.
(3) While TLV62130 has PG=High Z, TLV62130A features PG=Low, when device is in shutdown through EN, UVLO or Thermal Shutdown.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
AVIN, PVIN –0.3 20
V
EN, SS/TR –0.3 V
IN
+0.3
Pin voltage range
(2)
SW –0.3 V
IN
+0.3 V
DEF, FSW, FB, PG, VOS –0.3 7 V
Power Good sink current PG 10 mA
Operating junction temperature range, T
J
–40 125
Temperature range °C
Storage temperature range, T
stg
–65 150
HBM Human body model 2 kV
ESD rating
(3)
CDM Charge device model 0.5 kV
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network ground terminal.
(3) ESD testing is performed according to the respective JESD22 JEDEC standard.
THERMAL INFORMATION
TLV62130
THERMAL METRIC
(1)
UNITS
RGT 16 PINS
θ
JA
Junction-to-ambient thermal resistance 29.1
θ
JC(TOP)
Junction-to-case(top) thermal resistance 15
θ
JB
Junction-to-board thermal resistance 11
°C/W
ψ
JT
Junction-to-top characterization parameter 0.5
ψ
JB
Junction-to-board characterization parameter 10
θ
JC(BOTTOM)
Junction-to-case(bottom) thermal resistance 3.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
MIN TYP MAX UNIT
Supply Voltage, V
IN
(at AVIN and PVIN) 4 17 V
Operating free air temperature, T
A
–40 85 °C
Operating junction temperature, T
J
–40 125 °C
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