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Schematic and Bill of Materials

5.2 Bill of Materials

Table 2. TLV621x0EVM-505 Bill of Materials

Count

-004 -005 RefDes Value Description Size Part Number MFR

1 1 C1 10 µF Capacitor, Ceramic, 25V, X5R, 20% 1210 Std Std

1 1 C3 22 µF Capacitor, Ceramic, 6.3V, X5R, 20% 0805 Std Std

1 1 C5 3300 pF Capacitor, Ceramic, 25V, X7R, 10% 0603 Std Std

1 1 C6 68 µF Capacitor, Tantalum, 35V, 68uF, ±20% 7361[V] TPSV686M035R0150 AVX

1 0 C7 0.1 µF Capacitor, Ceramic, 25V, X5R, 20% 0603 Std Std

1 0 L1 1.0 µH Inductor, Power, 5.1A, ±20% 0.165 x 0.165 inch XFL4020-102ME Coilcraft

0 1 L1 2.2 µH Inductor, Power, 3.5A, ±20% 0.165 x 0.165 inch XFL4020-222ME Coilcraft

1 1 R1 1.21M Resistor, Chip, 1/16W, 1% 0603 Std Std

1 1 R2 383k Resistor, Chip, 1/16W, 1% 0603 Std Std

1 1 R3 100k Resistor, Chip, 1/16W, 1% 0603 Std Std

1 0 U1

(1)

TLV62130ARGT IC, 17V 3A Step-Down Converter in 3 mm x 3 mm QFN 3 x 3 mm QFN TLV62130ARGT TI

Package

0 1 U1

(1)

TLV62150ARGT IC, 17V 1A Step-Down Converter in 3 mm x 3 mm QFN 3 x 3 mm QFN TLV62150ARGT TI

Package

(1)

EVMs made before August of 2013 use the non-A version of U1. The only difference between these devices is the operation of the PG

pin when the device is disabled, as shown in Figure 15 and Figure 16.

SLAU416A–January 2012–Revised July 2013 TLV62130EVM-505 and TLV62150EVM-505 Evaluation Modules

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